公开(公告)号：US20180074697A1

公开(公告)日：2018-03-15

申请号：US15703508

申请日：2017-09-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hye Won KIM ,  Dong Kyun KANG ,  Kyung Hwa KIM ,  Na Hye KIM ,  Woo Hyun KIM ,  Ju Young KIM ,  Mi Ji PARK ,  Sung Won PARK ,  Ji Yeon SUNG ,  Dong Jin EUN ,  Seung Yong LEE ,  Jae Han LEE ,  Jin A. LEE ,  Min Young CHANG ,  Kyung Lim CHOI ,  Seung Pyo HONG ,  Jee Yeun WANG ,  Ah Young KIM ,  Jun Ho CHOI ,  Dae Hong KI ,  Hee Woon KIM ,  Wan Je PARK ,  Sung Chan BAE ,  Jung Eui SEO

IPC: G06F3/0488 ,  G06F3/041

CPC classification number: G06F3/04886 ,  G06F3/041 ,  G06F3/0482 ,  G06F2203/04105 ,  G06F2203/04106 ,  G06F2203/04108 ,  G06F2203/04803

Abstract: An electronic device is provided that includes a memory, a display that detects a force input based on an external pressure, and a processor electrically coupled with the memory and the display. The processor executes an application that is operable corresponding to the force input, controls to store history information in the memory on use of the electronic device, the history information being related to a forcing point, to which the force input is applied, on an execution screen of the application, and controls to output via the display the history information to an area adjacent to the forcing point if the force input to the forcing point occurs.

公开(公告)号：US20170263998A1

公开(公告)日：2017-09-14

申请号：US15454537

申请日：2017-03-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Won PARK ,  Sun Young KIM ,  Seung Yup LEE

IPC: H01Q1/12 ,  H01Q1/50 ,  H05K7/14

CPC classification number: H01Q1/12 ,  H01Q1/50 ,  H04M1/0277 ,  H05K7/1427

Abstract: An electronic device is provided. The electronic device includes a circuit board, a first conductive member electrically connected to the circuit board at a first point, a second conductive member electrically connected to the circuit board at a second point, and a connection member connecting the first conductive member and the second conductive member, where the connection member includes a first conductive layer electrically connected to the first conductive member, a second conductive layer electrically connected to the second conductive member, and a dielectric layer disposed between the first conductive layer and the second conductive layer.