公开(公告)号：US20220005811A1

公开(公告)日：2022-01-06

申请号：US17182315

申请日：2021-02-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eun Jung KIM ,  Hye Won KIM ,  Sung Yeon RYU

IPC: H01L27/108

Abstract: A semiconductor device includes a plurality of first conductive patterns extending parallel in a first direction on a substrate, a plurality of second conductive patterns extending parallel in a second direction crossing the first direction on the substrate, a plurality of buried contacts connected to the substrate between the plurality of first conductive patterns and between the plurality of second conductive patterns, and a landing pad connected to each of the buried contacts on the plurality of buried contacts. The landing pad includes a first side surface extending in the first direction in plan view and a second side surface extending in a third direction in plan view. The third direction is different from the first direction and the second direction in plan view.