Abstract:
An inspecting apparatus for a semiconductor device having a match plate; a contact module combined with the match plate, including a radiation unit contacting a semiconductor device, and a test unit pressing leads of the semiconductor device; and a thermally conductive pad installed on a contacting face of the radiation unit of the contact module, to transfer heat from the semiconductor device to the radiation unit of the contact module. The present invention provides an inspecting apparatus for semiconductor devices that improves reliability of testing for durability of semiconductor devices against heat, and minimizes damage to the semiconductor devices during testing.
Abstract:
A key switch of a keyboard of the present invention includes a key cap and an elastic body which supports and allows the key cap to elastically move up and down. The elastic body is a band shaped structure and includes end portions which are pivotally supported above a substrate, a central portion bulged to contact a bottom surface of the key cap, and curved portions having a curvature opposite to that of the central portion disposed between corresponding ones of the end portions and the central portion. The curved portions of the elastic body are deformed at a position lower than an upper surface of the substrate. Therefore, the overall height of the key switch can be reduced, allowing for the manufacture of a slimmer keyboard unit.
Abstract:
An inspecting apparatus for semiconductor devices including: a match plate; a contact module combined with the match plate, and the match plate including a radiation unit radiating heat from the semiconductor devices to the outside, and a test unit contacting leads of the semiconductor; an insert module installed on a bottom of the contact module, and having a semiconductor device accommodator to accommodate the semiconductor device; and an auxiliary radiation member installed on a bottom of the insert module, and radiating the heat from the semiconductor device to the outside. Accordingly, the inspecting apparatus for semiconductor device according to the present invention performs testing at a constant temperature regardless of heat from the semiconductors by radiating the heat from the semiconductors immediately and efficiently, thereby producing more accurate test results. Accurate testing improves productivity and saves expense by removing faulty test results caused by identifying a qualified semiconductor as a defective semiconductor due to heat radiated from the semiconductor device.
Abstract:
An inspecting apparatus for semiconductor devices comprising: a match plate; a contact module combined with the match plate, itself comprising a radiator to radiate heat from the semiconductor device to the outside and a tester to contact the leads of the semiconductor device; and a heat pipe provided in the radiator. Accordingly, the inspecting apparatus for semiconductor devices according to the present invention performs testing at a constant temperature, regardless of heat from the semiconductor device, by transferring heat from the semiconductor device quickly and efficiently, thereby producing more accurate test results. The inspecting apparatus for semiconductor devices according to the present invention improves productivity and saves expense by removing faulty test results caused by incorrectly identifying qualified semiconductor devices as defective semiconductor devices.
Abstract:
A host apparatus includes an ultrasound receiving unit receiving an ultrasound signal from a pointing apparatus and outputting an electric signal. A controlling unit calculates a position of a pointer on a display screen corresponding to a position of the pointing apparatus based on the electric signal from the ultrasound receiving unit, and outputs a control signal to the display screen to position the pointer at the calculated position of the display screen.