公开(公告)号：US20250007148A1

公开(公告)日：2025-01-02

申请号：US18786248

申请日：2024-07-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongmin KIM ,  Eunbae KWON ,  Hyoseok NA ,  Kyonghwan CHO ,  Sungjae MOON ,  Wanjae JU

IPC: H01Q1/24 ,  H01Q1/38 ,  H04M1/02

Abstract: According to an example embodiment of the disclosure, an electronic device is provided. The electronic device includes a front cover forming at least a portion of the front surface of the electronic device, a non-conductive case including a rear portion forming at least a portion of the rear surface of the electronic device and a side portion forming at least a portion of the side surface of the electronic device, a support positioned between the front cover and the non-conductive case and including a first portion and a second portion, wherein the first portion is positioned between the second portion and the side portion, a first conductive pattern disposed between the first portion or the side portion, a second conductive pattern positioned between the second portion and the rear portion and spaced apart from the first conductive pattern, a wireless communication circuit configured to transmit a signal in a designated frequency band through the first conductive pattern and the second conductive pattern, and a seal disposed between the first portion and the rear portion and configured to block fluid flow from a first area where the first conductive pattern is disposed to a second area where the second conductive pattern is disposed.