公开(公告)号：US11551944B2

公开(公告)日：2023-01-10

申请号：US17012624

申请日：2020-09-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungyong Yun ,  Sanghoon Lee ,  Sungil Lee

IPC: H01L21/67 ,  H01L23/00

Abstract: An apparatus for forming a solder bump on a substrate including a supporter configured to support the substrate to be provided thereon, a housing surrounding the supporter, a cover defining a manufacturing space in combination with the housing and including an edge heating zone along a perimeter thereof, the manufacturing space surrounding the supporter, and an oxide remover supply nozzle configured to supply an oxide remover to the manufacturing space may be provided.

公开(公告)号：US12068176B2

公开(公告)日：2024-08-20

申请号：US18063029

申请日：2022-12-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungyong Yun ,  Sanghoon Lee ,  Sungil Lee

IPC: H01L21/67 ,  H01L23/00

CPC classification number: H01L21/67098 ,  H01L24/11 ,  H01L24/13

Abstract: An apparatus for forming a solder bump on a substrate including a supporter configured to support the substrate to be provided thereon, a housing surrounding the supporter, a cover defining a manufacturing space in combination with the housing and including an edge heating zone along a perimeter thereof, the manufacturing space surrounding the supporter, and an oxide remover supply nozzle configured to supply an oxide remover to the manufacturing space may be provided.