公开(公告)号：US20240397625A1

公开(公告)日：2024-11-28

申请号：US18792851

申请日：2024-08-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myungkyoon CHUNG ,  Sunyoung IM ,  Dohyeong PARK

IPC: H05K1/14

Abstract: An electronic device including an interposer printed circuit board (PCB) may comprise: an interposer PCB including at least two vias; a first PCB including a first direct connection unit including a power supply circuit and configured to directly connect the power supply circuit to a first via, and a first extension connection unit comprising a conductive material configured to connect a second via through a wire extending from the first direct connection unit; and a second PCB including a second direct connection unit including a load circuit and configured to directly connect the load circuit to the second via, and a second extension connection unit comprising a conductive material configured to connect the first via through a wire extending from the second direct connection unit.