公开(公告)号：US20240397625A1

公开(公告)日：2024-11-28

申请号：US18792851

申请日：2024-08-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myungkyoon CHUNG ,  Sunyoung IM ,  Dohyeong PARK

IPC: H05K1/14

Abstract: An electronic device including an interposer printed circuit board (PCB) may comprise: an interposer PCB including at least two vias; a first PCB including a first direct connection unit including a power supply circuit and configured to directly connect the power supply circuit to a first via, and a first extension connection unit comprising a conductive material configured to connect a second via through a wire extending from the first direct connection unit; and a second PCB including a second direct connection unit including a load circuit and configured to directly connect the load circuit to the second via, and a second extension connection unit comprising a conductive material configured to connect the first via through a wire extending from the second direct connection unit.

公开(公告)号：US20250056723A1

公开(公告)日：2025-02-13

申请号：US18928679

申请日：2024-10-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dohyeong PARK ,  Junghoon PARK ,  Myungkyoon CHUNG

IPC: H05K1/11 ,  H05K1/14 ,  H05K3/02 ,  H05K3/40

Abstract: An electronic device is provided. The electronic device includes a housing forming an exterior of at least part of the electronic device, a battery disposed to an inner space of the electronic device formed by the housing, and a printed board assembly (PBA) disposed between the battery and a side member of the housing in the inner space, the PBA including a first printed circuit board (PCB), a second PCB, and an interposer PCB disposed between the first PCB and the second PCB to connect the first PCB and the second PCB, wherein the interposer PCB includes an insulating layer which includes a first face and a second face opposite to the first face, a first via group which penetrates the insulating layer to connect the first face and the second face, and includes a plurality of first vias formed spaced apart from each other, the plurality of first vias included in the first via group being used as a first transmission path through which a first signal passes, a first conductive pad which is disposed on the first face to cover first holes of the plurality of first vias, formed on the first face, and is electrically coupled to the plurality of first vias, and a first solder layer which is disposed on the first conductive pad, wherein the first conductive pad extends by a first width in a first direction along the first face of the insulating layer, and wherein the first solder layer extends by a second width smaller than the first width in the first direction.

公开(公告)号：US20240422911A1

公开(公告)日：2024-12-19

申请号：US18627096

申请日：2024-04-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dohyeong PARK ,  Junghoon PARK

IPC: H05K1/14 ,  H05K1/18 ,  H05K5/00

Abstract: According to an embodiment, an electronic device includes a first printed circuit board and a second printed circuit board, facing the first printed circuit board, disposed over the first printed circuit board. The electronic device includes a first support member disposed on a first surface of the first printed circuit board. The electronic device includes a second support member, disposed on a second surface of the second printed circuit board, facing the first printed circuit board and configured to come into contact with the first support member by an external force applied to the electronic device. The electronic device includes an interposer between the first printed circuit board and the second printed circuit board, surrounding an area between the first surface and the second surface.