公开(公告)号：US11903147B2

公开(公告)日：2024-02-13

申请号：US17069965

申请日：2020-10-14

申请人： Samsung Electronics Co., Ltd.

发明人： Hangyu Hwang ,  Youngjong Shin ,  Sangbeom Ko ,  Sungho Cho ,  Sunyoung Ji ,  Younghee Choi ,  Changyoun Hwang

IPC分类号： H05K5/00 ,  B29C45/26 ,  H04B1/3827 ,  H04M1/02 ,  B29C45/37 ,  B29L31/34

CPC分类号： H05K5/0004 ,  B29C45/372 ,  H04M1/0283 ,  B29L2031/3475

摘要： An electronic device and method for forming a housing of the same is disclosed. The electronic device includes: a housing including: a first plate forming a front surface of the housing, a second plate integrally forming a rear surface and side surface of the housing, wherein a space is enclosed between the front surface, side surface and rear surface, and wherein the second plate includes a first surface forming the side and rear surfaces of the housing, and a second surface disposed opposite to the first surface, and a display disposed in the space and at least partially visible through the first plate, wherein at least a portion of the second surface includes a pattern having surface roughness having a height of 0.1 μm to 1 μm.