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公开(公告)号：US11903147B2
公开(公告)日：2024-02-13
申请号：US17069965
申请日：2020-10-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hangyu Hwang , Youngjong Shin , Sangbeom Ko , Sungho Cho , Sunyoung Ji , Younghee Choi , Changyoun Hwang
CPC classification number: H05K5/0004 , B29C45/372 , H04M1/0283 , B29L2031/3475
Abstract: An electronic device and method for forming a housing of the same is disclosed. The electronic device includes: a housing including: a first plate forming a front surface of the housing, a second plate integrally forming a rear surface and side surface of the housing, wherein a space is enclosed between the front surface, side surface and rear surface, and wherein the second plate includes a first surface forming the side and rear surfaces of the housing, and a second surface disposed opposite to the first surface, and a display disposed in the space and at least partially visible through the first plate, wherein at least a portion of the second surface includes a pattern having surface roughness having a height of 0.1 μm to 1 μm.
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公开(公告)号：US12035489B2
公开(公告)日：2024-07-09
申请号：US17861387
申请日：2022-07-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngjong Shin , Hangyu Hwang , Changsu Kim , Hyeonwoo Lee , Sungho Cho , Jeonga Kang , Hyunsuk Choi
CPC classification number: H05K5/02 , G02B3/005 , G02B5/045 , H05K5/0086 , H05K5/03 , G02B3/0025 , G02B3/0031
Abstract: According to an embodiment of the disclosure, an electronic device may include a housing including a rear plate including a first region having a first concavo-convex pattern formed therein, and a second region having a second concavo-convex pattern formed therein, and a processor disposed inside the housing. The first concavo-convex pattern and the second concavo-convex pattern may be integrally formed with the rear plate, and a first depth of the first concavo-convex pattern may be different from a second depth of the second concavo-convex pattern.
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