公开(公告)号：US12119248B2

公开(公告)日：2024-10-15

申请号：US18183520

申请日：2023-03-14

申请人： Samsung Electronics Co., Ltd.

发明人： Taegeon Kim

IPC分类号： H01L21/673

CPC分类号： H01L21/67333

摘要： A module tray for a semiconductor device includes a case and an insert block. The case includes a base plate, first and second sidewalls extending from opposite sides of the base plate in a vertical direction to define an accommodation space, and first and second fastening grooves respectively formed in inner surfaces of the first and second sidewalls. The first and second fastening grooves have upper ends opened to upper surfaces of the first and second sidewalls, respectively. The insert block has a substrate accommodating space for accommodating a semiconductor substrate. The insert block is detachably inserted into the first and second fastening grooves of the case. The insert block has first and second fastening joints extending in the vertical direction such that the first and second fastening joint are respectively inserted through the upper ends of the first and second fastening grooves.