公开(公告)号：US11970342B2

公开(公告)日：2024-04-30

申请号：US17930082

申请日：2022-09-07

申请人： CHROMA ATE INC.

发明人： Chien-Ming Chen ,  Jui-Hsiung Chen ,  Chi-Wei Wang

IPC分类号： B65G47/90 ,  G01N3/04 ,  G01N3/06 ,  G01N3/12 ,  G01R31/28 ,  H01L21/673 ,  H05K13/04

CPC分类号： B65G47/905 ,  G01N3/04 ,  G01N3/06 ,  G01N3/12 ,  G01R31/2867 ,  G01R31/2874 ,  G01R31/2887 ,  G01R31/2893 ,  H01L21/67333 ,  H05K13/0408 ,  G01N2203/0044 ,  G01N2203/0411

摘要： The present invention relates to a chip tray positioning device, which mainly comprises a frame body, a tray conveying module, a pulling module, a pushing module and a controller. The tray conveying module is disposed on the frame body, electrically connected to the controller and controlled to convey a chip tray from the start area to the end area. The pulling module and the pushing module are disposed on the frame body, electrically connected to the controller and controlled to cause the chip tray to be abutted against the end wall and the lateral wall of the frame body, thereby realizing the positioning of the chip tray and eliminating an error formed in the transfer process of the chip tray. In addition, the controller also controls the pushing module to knock the chip tray at a specific frequency so that the chip tray is vibrated.

公开(公告)号：US11932498B2

公开(公告)日：2024-03-19

申请号：US17931148

申请日：2022-09-12

申请人： CHROMA ATE INC.

发明人： Chin-Yi Ouyang ,  Chin-Yuan Kuo ,  Chang-Jyun He ,  Yung-Fan Chu

IPC分类号： G01R31/28 ,  B65G47/90 ,  G01N3/04 ,  G01N3/06 ,  G01N3/12 ,  H01L21/673 ,  H05K13/04

CPC分类号： B65G47/905 ,  G01N3/04 ,  G01N3/06 ,  G01N3/12 ,  G01R31/2867 ,  G01R31/2874 ,  G01R31/2887 ,  G01R31/2893 ,  H01L21/67333 ,  H05K13/0408 ,  G01N2203/0044 ,  G01N2203/0411

摘要： A temperature control system and method for devices under test and an image sensor-testing apparatus having the system are provided. The temperature control method for devices under test mainly comprises the steps of regulating the temperatures of a plurality of devices under test (DUTs) to a specific temperature in a temperature control zone; transferring the plurality of devices under test to a test plate and placing them into a plurality of test slots respectively; and measuring the temperatures of the device under test by the temperature-sensing elements in the test slots, wherein when at least one temperature-sensing element of the temperature-sensing elements detects that the device under test in the test slot corresponding to said at least one temperature-sensing element fails to meet the specific temperature, a temperature control element corresponding to the test slot regulates the temperature of the device under test.

公开(公告)号：US20240047249A1

公开(公告)日：2024-02-08

申请号：US17879651

申请日：2022-08-02

申请人： VisEra Technologies Company Ltd.

发明人： Yi-Feng YEN ,  Shih-Lung HSU ,  Kuo-Hsing TENG ,  Cheng-Hsiung TUNG

IPC分类号： H01L21/673 ,  H01L21/677

CPC分类号： H01L21/67333 ,  H01L21/6773

摘要： A transfer system for wafer cassettes includes a tray and a rail compatible with the tray. The tray includes a base plate, a through hole, a wall, and a pair of first positioning features. The through hole is disposed on a center of the base plate, in which the through hole has a first direction axis and a second direction axis perpendicular to the first direction axis. The wall extends from a surface of the base plate and surrounding the through hole, in which the wall separates the base plate into an interior region and an exterior region. The pair of first positioning features having a first level height are in the interior region and arranged parallel to the first direction axis.

公开(公告)号：US09887114B2

公开(公告)日：2018-02-06

申请号：US14907748

申请日：2015-08-27

申请人： BOE TECHNOLOGY GROUP CO., LTD.

发明人： Yang Xing

IPC分类号： B65D85/00 ,  H01L21/673 ,  A45C11/24

CPC分类号： H01L21/67333 ,  A45C11/24 ,  H01L21/68 ,  H01L24/75 ,  H01L2224/756

摘要： An IC cartridge is provided, which includes: a cartridge body provided with hollowed-out parts, and an ejection mechanism including a substrate and projected structures which are provided on the substrate and can be slideably extended into the hollowed-out parts for pushing out IC chips; the hollowed-out parts and the projected structures cooperate to form groove structures for accommodating the IC chips. In usage, the IC chip in the groove structure are pushed out by sliding of the projected structures of the ejection mechanism through the hollowed-out parts. Thus, removing and flipping over of the IC chips is facilitated, and the processing safety of the IC chip can be ensured.

公开(公告)号：US09887113B2

公开(公告)日：2018-02-06

申请号：US14830213

申请日：2015-08-19

申请人： Synaptics Japan GK

发明人： Koji Akimoto ,  Hisao Nakamura ,  Tsutomu Fukaya

IPC分类号： H01L21/673 ,  B65D1/36

CPC分类号： H01L21/67333 ,  B65D1/36

摘要： A semiconductor chip tray is provided that includes a support plate, a first protruding portion, a second protruding portion and a recess. The first protruding portion forms a housing space for a semiconductor chip by being provided on a top surface of the support plate. The second protruding portion is provided on a bottom surface of the support plate, and is fitted to an outer periphery of the first protruding portion of another semiconductor chip tray when the tray is stacked so as to overlap the other tray. The recess is provided on the bottom surface of the support plate. The recess faces a part of the first protruding portion of another chip tray when the tray is stacked so as to overlap the other tray. The recess is formed extending up to an outside of the first protruding portion from the housing space formed by the first protruding portion.

公开(公告)号：US20180033137A1

公开(公告)日：2018-02-01

申请号：US15664504

申请日：2017-07-31

申请人： Delta Design, Inc.

发明人： Kexiang Ken DING ,  James FRANDSEN ,  Chris DO

IPC分类号： G06T7/00 ,  G06T7/70

CPC分类号： G06T7/0008 ,  G01N21/8851 ,  G01N2021/95638 ,  G01S17/026 ,  G01S17/46 ,  G06T7/70 ,  G06T2207/30148 ,  G06T2207/30204 ,  H01L21/67259 ,  H01L21/67333

摘要： A system for detecting a status of a pocket of a tray includes a tray having a plurality of pockets that hold an integrated circuit device, a vision mechanism, a light line generator, a reflective device, and a controller. The vision mechanism images the tray along a first optical axis. The light line generator emits a light line along a second optical axis. The reflective device reflects the light line onto the tray along a third optical axis. The third optical axis has a different angle relative to the first optical axis than an angle between the first optical axis and the second optical axis. The controller receives an image of the tray from the vision mechanism, detects the light line reflected onto the tray along the third optical axis, and determines a status of a pocket based on the detected light line along the third optical axis.

公开(公告)号：US20170372927A1

公开(公告)日：2017-12-28

申请号：US15190813

申请日：2016-06-23

申请人： SHARP LABORATORIES OF AMERICA, INC.

发明人： PAUL JOHN SCHUELE ,  DAVID ROBERT HEINE ,  MARK ALBERT CROWDER ,  SEAN MATHEW GARNER ,  CHANGQING ZHAN ,  AVINASH TUKARAM SHINDE ,  KENJI ALEXANDER SASAKI ,  KURT MICHAEL ULMER

IPC分类号： H01L21/67 ,  H01L21/673 ,  H01L29/06 ,  H01L33/20

CPC分类号： H01L21/67121 ,  H01L21/67333 ,  H01L29/0657 ,  H01L33/20 ,  H01L2224/95085

摘要： Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.

公开(公告)号：US20170282207A1

公开(公告)日：2017-10-05

申请号：US15624932

申请日：2017-06-16

申请人： NORDSON CORPORATION

发明人： Christopher L. Giusti ,  Philip P. Maiorca ,  Mark S. Meier ,  David N. Padgett

IPC分类号： B05C11/10 ,  B05B13/04 ,  B05C5/02

CPC分类号： B05B12/124 ,  B05B3/00 ,  B05B13/0442 ,  B05C5/0216 ,  B05C5/027 ,  B05C11/1018 ,  B05C11/1021 ,  B05C13/02 ,  B05D1/02 ,  H01L21/67333

摘要： Methods for simultaneously dispensing a first fluid pattern at a first dispense region with a first applicator and a second fluid pattern at a second dispense region with a second applicator. The first and second applicators are moved toward their respective dispense regions with a positioner. While dispensing, the second applicator is moved relative to the first applicator in a direction or directions parallel to a first axis, a second axis, and/or a third axis, the axes being mutually orthogonal. The first dispense region may be provided with a unique first tilt and/or a unique first contour relative to the reference plane and along the third axis. Systems for dispensing fluid include a primary positioner supporting a first applicator, and a secondary positioner coupled to the primary positioner and supporting a second applicator and configured to move the second applicator relative to the first applicator.

公开(公告)号：US20170170047A1

公开(公告)日：2017-06-15

申请号：US15113299

申请日：2015-01-21

申请人： ULVAC, INC.

发明人： Toshiyuki NAKAMURA ,  Naoki MORIGUCHI ,  Ryuichiro KAMIMURA ,  Yamato OSADA ,  Tsuyoshi AIHARA

IPC分类号： H01L21/683 ,  H01L21/67 ,  H01J37/32 ,  H01L21/673

CPC分类号： H01L21/6833 ,  H01J37/32724 ,  H01J37/32733 ,  H01L21/67069 ,  H01L21/67098 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67313 ,  H01L21/67333 ,  H01L21/6831 ,  H01L21/68771

摘要： A plasma treatment apparatus includes a wafer transfer tray having a first surface and a second surface opposite to the first surface and configured to hold a wafer on the first surface, a cooling unit configured to cool the wafer transfer tray, a conductive supporter configured to support the second surface of the wafer transfer tray, and a double-surface electrostatic attractor configured to electrostatically attract the wafer to the first surface of the wafer transfer tray and electrostatically attract the supporter to the second surface of the wafer transfer tray.

公开(公告)号：US09455174B2

公开(公告)日：2016-09-27

申请号：US13932451

申请日：2013-07-01

申请人： COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT

发明人： Loic Sanchez ,  Laurent Bally ,  Brigitte Montmayeul

IPC分类号： H01L21/683 ,  H01L21/673

CPC分类号： H01L21/6838 ,  H01L21/673 ,  H01L21/67333 ,  Y10T29/49819 ,  Y10T29/49998 ,  Y10T29/53091 ,  Y10T29/53165 ,  Y10T29/53174 ,  Y10T29/53961

摘要： A system is provided for individually supporting at least one component having opposing front and back faces, including a supporting device having a plurality of cells each delimited by a wall and having a contact zone to support the component, at least a part of the cells each receiving a component by its front face, the supporting and contact zones are configured so a surface of the front face is not in contact with the wall, the contact zone is located on a periphery of the front face and forms a closed zone around the front face, the supporting zone forms a closed zone on the wall, and the contact zone includes an edge surface set back in a thickness direction with respect to the front face, the thickness direction extending from the front to the back face perpendicular to at least one of the faces.

摘要翻译： 提供了一种用于单独地支撑具有相对的前表面和后表面的至少一个部件的系统，包括支撑装置，所述支撑装置具有多个单元，每个单元由壁限定，并且具有用于支撑所述部件的接触区域，每个单元的至少一部分 通过其前表面接收部件，支撑和接触区域被构造成使得前表面的表面不与壁接触，接触区域位于前表面的周边上并且围绕前部形成封闭区域 所述支撑区域在所述壁上形成封闭区域，并且所述接触区域包括相对于所述前表面在厚度方向上设置的边缘表面，所述厚度方向从至少一个垂直于所述前部的背面延伸 的脸。