公开(公告)号：US11032459B2

公开(公告)日：2021-06-08

申请号：US16053128

申请日：2018-08-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hwajoong Jung ,  Manho Kim ,  Taehyuk Kim ,  Taeyun Kim ,  Yonghwan Choi ,  Kihuk Lee

IPC: H04N5/225 ,  H05K1/02

Abstract: An apparatus and method for a camera module is provided. The camera module includes a substrate, a first image sensor disposed in a first area on one side of the substrate, a second image sensor disposed in a second area on the one side, a reinforcement member disposed in an area around the first area and the second area so as to support at least a portion of the substrate, a first housing disposed in an area including at least a portion of the first area so as to be stacked on the first image sensor and one part of the reinforcement member while accommodating a first lens part corresponding to the first image sensor, and a second housing disposed in an area including at least a portion of the second area so as to be stacked on the second image sensor and the other part of the reinforcement member.

公开(公告)号：US20240074155A1

公开(公告)日：2024-02-29

申请号：US18236143

申请日：2023-08-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taehyuk Kim ,  Taegyu Kang ,  Seokho Shin ,  Kiseok Lee ,  Sangho Lee ,  Keunnam Kim ,  Seokhan Park ,  Joongchan Shin ,  Moonyoung Jeong ,  Eunju Cho

IPC: H10B12/00

CPC classification number: H10B12/482 ,  H10B12/315 ,  H10B12/488

Abstract: A semiconductor device includes a substrate, a bit line extending on the substrate in a first direction, first and second active patterns on the bit line, a back-gate electrode between the first and second active patterns and extending across the bit line and in a second direction that is perpendicular to the first direction, a first word line extending in the second direction at one side of the first active pattern, a second word line extending in the second direction at the other side of the second active pattern, and a contact pattern connected to each of the first and second active patterns, wherein the contact pattern sequentially includes an epitaxial growth layer, a doped polysilicon layer, and a silicide layer.

公开(公告)号：US20190068846A1

公开(公告)日：2019-02-28

申请号：US16053128

申请日：2018-08-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hwajoong Jung ,  Manho Kim ,  Taehyuk Kim ,  Taeyun Kim ,  Yonghwan Choi ,  Kihuk Lee

IPC: H04N5/225 ,  G02B7/02

Abstract: An apparatus and method for a camera module is provided. The camera module includes a substrate, a first image sensor disposed in a first area on one side of the substrate, a second image sensor disposed in a second area on the one side, a reinforcement member disposed in an area around the first area and the second area so as to support at least a portion of the substrate, a first housing disposed in an area including at least a portion of the first area so as to be stacked on the first image sensor and one part of the reinforcement member while accommodating a first lens part corresponding to the first image sensor, and a second housing disposed in an area including at least a portion of the second area so as to be stacked on the second image sensor and the other part of the reinforcement member.