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公开(公告)号:US20250007166A1
公开(公告)日:2025-01-02
申请号:US18708975
申请日:2022-11-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jungwoo SEO , Jungi JEONG , Taeksun KWON , Chanju PARK , Dongjin JUNG , Sanghyuk WI , Seungyoon LEE
Abstract: The present disclosure relates to a 5G or 6G communication system for supporting a higher data transmission rate than a 4G communication system such as LTE. An electronic device comprising an antenna module, according to an embodiment of the present disclosure, comprises: a communication module for communicating with an external electronic device; a first antenna module including a plurality of first antenna cells and first dummy cells surrounding the plurality of first antenna cells; and a controller for controlling the communication module and the first antenna module. Each of the plurality of first antenna cells may be configured to have a first size, and each of the first dummy cells may be configured to have a second size smaller than the first size.
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公开(公告)号:US20240266744A1
公开(公告)日:2024-08-08
申请号:US18563132
申请日:2022-04-19
Applicant: Samsung Electronics Co., Ltd.
Inventor: Taeksun KWON , Chanju PARK , Jungi JEONG , Jungwoo SEO , Seungyoon LEE , Dongjin JUNG
CPC classification number: H01Q9/0414 , H01Q21/0006 , H01Q21/065
Abstract: A stacked patch antenna includes an upper ground plate including a first upper hole, a first feed pad provided on the upper ground plate, a first feed line extending from the first feed pad along a first direction, a lower antenna patch provided on the first feed pad, an upper antenna patch provided on the lower antenna patch, a first upper pad provided in the first upper hole, and a first upper stub protruding from a side surface of the first upper pad.
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公开(公告)号:US20240235009A9
公开(公告)日:2024-07-11
申请号:US18547977
申请日:2022-04-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Dongjin JUNG , Chanju PARK , Jungi JEONG , Taeksun KWON , Jungwoo SEO , Junhwa OH
CPC classification number: H01Q1/243 , H01Q1/38 , H01Q21/0075
Abstract: An antenna module, according to various embodiments, may comprise: a first layer including a first etching region, a first via pad disposed to be spaced apart from an edge of the first etching region, and a first via hole disposed on one surface of the first via pad; and a second layer stacked on one surface of the first layer, and including a second etching region, a plurality of second via pads disposed to be spaced apart from an edge of the second etching region, a plurality of second via holes disposed on one surface of the plurality of second via pads, and a plurality of second dividing lines electrically connecting the plurality of second via pads.
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公开(公告)号:US20240136703A1
公开(公告)日:2024-04-25
申请号:US18547977
申请日:2022-04-27
Applicant: Samsung Electronics Co., Ltd.
Inventor: Dongjin JUNG , Chanju PARK , Jungi JEONG , Taeksun KWON , Jungwoo SEO , Junhwa OH
CPC classification number: H01Q1/243 , H01Q1/38 , H01Q21/0075
Abstract: An antenna module, according to various embodiments, may comprise: a first layer including a first etching region, a first via pad disposed to be spaced apart from an edge of the first etching region, and a first via hole disposed on one surface of the first via pad; and a second layer stacked on one surface of the first layer, and including a second etching region, a plurality of second via pads disposed to be spaced apart from an edge of the second etching region, a plurality of second via holes disposed on one surface of the plurality of second via pads, and a plurality of second dividing lines electrically connecting the plurality of second via pads.
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公开(公告)号:US20240039161A1
公开(公告)日:2024-02-01
申请号:US18361163
申请日:2023-07-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Chanju PARK , Sanghyuk WI , Dongjin JUNG , Taeksun KWON , Jungwoo SEO , Junhwa OH
CPC classification number: H01Q9/0414 , H01Q1/526 , H01Q1/2283
Abstract: The disclosure relates to a fifth generation (5G) or a sixth generation (6G) communication system for supporting a higher data transfer rate. A dual polarization patch antenna structure and an electronic device including same are provided.
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