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公开(公告)号:US20240136703A1
公开(公告)日:2024-04-25
申请号:US18547977
申请日:2022-04-27
Applicant: Samsung Electronics Co., Ltd.
Inventor: Dongjin JUNG , Chanju PARK , Jungi JEONG , Taeksun KWON , Jungwoo SEO , Junhwa OH
CPC classification number: H01Q1/243 , H01Q1/38 , H01Q21/0075
Abstract: An antenna module, according to various embodiments, may comprise: a first layer including a first etching region, a first via pad disposed to be spaced apart from an edge of the first etching region, and a first via hole disposed on one surface of the first via pad; and a second layer stacked on one surface of the first layer, and including a second etching region, a plurality of second via pads disposed to be spaced apart from an edge of the second etching region, a plurality of second via holes disposed on one surface of the plurality of second via pads, and a plurality of second dividing lines electrically connecting the plurality of second via pads.
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公开(公告)号:US20240120642A1
公开(公告)日:2024-04-11
申请号:US18272917
申请日:2022-01-26
Applicant: Samsung Electronics Co., Ltd.
Inventor: Chanju PARK , Junhwa OH , Sanghyuk WI , Jungi JEONG
Abstract: According to various embodiments disclosed in the present document, an antenna module and/or an electronic device including same may comprise: a communication circuit part; an antenna part stacked-up on or above the communication circuit part and comprising multiple antenna elements; and a network part disposed between the communication circuit part and the antenna part. The antenna part may comprise: at least one first subarray formed of a combination of some of the antenna elements; and at least one second subarray formed of a combination another of the antenna elements, and disposed to be point symmetric to the first subarray. The network part may comprise: a first transmission port corresponding to a transmission input terminal of the first subarray; a first reception port corresponding to a reception input terminal of the first subarray; a second transmission port corresponding to a transmission input terminal of the second subarray; and a second reception port corresponding to a reception input terminal of the second subarray. With respect to symmetric points of the first subarray and the second subarray, the first transmission port may be disposed to be point symmetric to the second reception port, and the first reception port may be disposed to be point symmetric to the second transmission port. Various other embodiments are possible.
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公开(公告)号:US20240421854A1
公开(公告)日:2024-12-19
申请号:US18704019
申请日:2022-10-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jungi JEONG , Junhwa OH , Sanghyuk WI , Seungyoon LEE , Yuntae PARK
Abstract: Provided is a 5G or 6G communication system for supporting higher data rates after the 4G communication system such as LTE.
According to the disclosure, a base station (BS) including a near field reflecting intelligent surface (RIS) may include the near field RIS including at least one meta surface which reflects an RIS beam into a target area, a transceiver and a processor. The processor may be configured to identify an operation mode among a normal mode or an RIS mode based on whether a target area is included in a reflecting beam coverage, and control the transceiver to transmit the RIS beam onto the meta surface based on at least one of a type of the near field RIS, configuration information of the near field RIS or information about the target area, in response to the operation mode being identified as the RIS mode.-
公开(公告)号:US20230198161A1
公开(公告)日:2023-06-22
申请号:US18102497
申请日:2023-01-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jungmin PARK , Hyunjin KIM , Seungtae KO , Yoongeon KIM , Bumhee LEE , Jungi JEONG
CPC classification number: H01Q21/0006 , H01Q5/307 , H01Q1/246 , H01Q9/0421 , H01Q21/26
Abstract: An antenna module includes: a first antenna unit, a second antenna unit, and a third antenna unit, each of the first antenna unit, the second antenna unit, and the third antenna unit including a first antenna element and a second antenna element that are crossed diagonally with each other; a first signal distributor configured to distribute a first radio frequency (RF) signal to the first antenna element of each of the first antenna unit, the second antenna unit, and the third antenna unit; a second signal distributor configured to distribute a second RF signal to the second antenna element of each of the first antenna unit, the second antenna unit, and the third antenna unit; and first stub circuits connected to line tracks of the first signal distributor connected to the first antenna unit, the second antenna unit, and the third antenna unit.
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公开(公告)号:US20230198138A1
公开(公告)日:2023-06-22
申请号:US18109476
申请日:2023-02-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jungi JEONG , Seungtae KO , Jongmin LEE , Yoongeon KIM , Bumhee LEE , Youngju LEE , Seungho CHOI
CPC classification number: H01Q1/42 , H01Q1/246 , H01Q9/0407 , H01Q21/06
Abstract: The disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). According to embodiments of the present disclosure, an electronic device may include: a printed circuit board (PCB); an antenna; a radome; and a coupling structure, the antenna may be disposed to be positioned at a first height from a first surface of the PCB, the coupling structure may be physically connected with the radome, and the coupling structure may be disposed to have a second height lower than or equal to the first height, with respect to the first surface of the PCB.
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公开(公告)号:US20250132500A1
公开(公告)日:2025-04-24
申请号:US18925642
申请日:2024-10-24
Inventor: Jungi JEONG , Jungsuek OH , Jaehoon KIM , Seungwoo BANG
Abstract: The present disclosure relates to a 5G communication system or a 6G communication system for supporting higher data rates beyond a 4G communication system such as long term evolution (LTE). A spatial filter is provided. The spatial filter includes a first substrate having a first parasitic element configured to provide a filtering function and disposed on the spatial filter device, a second substrate having a second parasitic element configured to provide a filtering function and disposed under the spatial filter device, and a dipole antenna configured to transmit and receive radio waves in free space, coupled to each of the first parasitic element and the second parasitic element so as not to be aligned therewith, and disposed between the first substrate and the second substrate.
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公开(公告)号:US20240195458A1
公开(公告)日:2024-06-13
申请号:US18536940
申请日:2023-12-12
Applicant: Samsung Electronics Co., Ltd.
Inventor: Junhwa OH , Yuntae PARK , Sanghyuk WI , Jungi JEONG
IPC: H04B7/04
CPC classification number: H04B7/04013
Abstract: A 5G communication system or a 6G communication system for supporting higher data rates beyond a 4G communication system such as long term evolution (LTE). A reconfigurable intelligent surface (RIS) including a plurality of unit cells in a wireless communication system includes a first pattern included in a top layer of a unit cell included in the RIS, a second pattern included in a bottom layer of the unit cell included in the RIS, and at least one switch configured to electrically ground or short the first pattern and the second pattern in response to a command for determining whether the unit cell included in the RIS operates as a transmissive RIS or a reflective RIS.
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公开(公告)号:US20240007176A1
公开(公告)日:2024-01-04
申请号:US18154604
申请日:2023-01-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jungi JEONG , Yuntae PARK , Junhwa OH , Seungyoon LEE , Sanghyuk WI
CPC classification number: H04B7/15528 , H04B7/026 , H01Q15/148
Abstract: The present disclosure relates to a 5G communication system or a 6G communication system for supporting higher data rates beyond a 4G communication system such as long term evolution (LTE). A unit cell of a RIS includes a first conductive structure including a first element and a second element disposed under the first element; a second conductive structure including a third element and a fourth element disposed under the third element; and a switch circuit disposed between the first conductive structure and the second conductive structure. As a first RF signal from a first external device is incident on the unit cell, a second RF signal having a first resonance frequency is reflected based on electrical paths formed respectively in the first element and the third element, and a third RF signal having a second resonance frequency different from the first resonance frequency is reflected based on electrical paths formed respectively in the second element and the fourth element.
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公开(公告)号:US20240266744A1
公开(公告)日:2024-08-08
申请号:US18563132
申请日:2022-04-19
Applicant: Samsung Electronics Co., Ltd.
Inventor: Taeksun KWON , Chanju PARK , Jungi JEONG , Jungwoo SEO , Seungyoon LEE , Dongjin JUNG
CPC classification number: H01Q9/0414 , H01Q21/0006 , H01Q21/065
Abstract: A stacked patch antenna includes an upper ground plate including a first upper hole, a first feed pad provided on the upper ground plate, a first feed line extending from the first feed pad along a first direction, a lower antenna patch provided on the first feed pad, an upper antenna patch provided on the lower antenna patch, a first upper pad provided in the first upper hole, and a first upper stub protruding from a side surface of the first upper pad.
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公开(公告)号:US20240235009A9
公开(公告)日:2024-07-11
申请号:US18547977
申请日:2022-04-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Dongjin JUNG , Chanju PARK , Jungi JEONG , Taeksun KWON , Jungwoo SEO , Junhwa OH
CPC classification number: H01Q1/243 , H01Q1/38 , H01Q21/0075
Abstract: An antenna module, according to various embodiments, may comprise: a first layer including a first etching region, a first via pad disposed to be spaced apart from an edge of the first etching region, and a first via hole disposed on one surface of the first via pad; and a second layer stacked on one surface of the first layer, and including a second etching region, a plurality of second via pads disposed to be spaced apart from an edge of the second etching region, a plurality of second via holes disposed on one surface of the plurality of second via pads, and a plurality of second dividing lines electrically connecting the plurality of second via pads.
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