Nonvolatile memory device and erase method thereof

    公开(公告)号:US11367487B2

    公开(公告)日:2022-06-21

    申请号:US16693925

    申请日:2019-11-25

    Abstract: A non-volatile memory device includes a memory cell array including a plurality of cell strings, each of the plurality of cell strings includes a gate-induced drain leakage (GIDL) transistor and a memory cell group, and a control logic to apply a voltage to each of the plurality of cell strings. The control logic performs a first erase operation of erasing the memory cell groups of each of the plurality of cell strings, a first verification operation of detecting erase results of the memory cell groups of each of the plurality of cell strings, and a program operation of programming the GIDL transistors of some of the plurality of cell strings.

    Erase method of non-volatile memory device

    公开(公告)号:US11783900B2

    公开(公告)日:2023-10-10

    申请号:US17840021

    申请日:2022-06-14

    CPC classification number: G11C16/16 G11C16/12 G11C16/24 G11C16/3445

    Abstract: A non-volatile memory device includes a memory cell array including a plurality of cell strings, each of the plurality of cell strings includes a gate-induced drain leakage (GIDL) transistor and a memory cell group, and a control logic to apply a voltage to each of the plurality of cell strings. The control logic performs a first erase operation of erasing the memory cell groups of each of the plurality of cell strings, a first verification operation of detecting erase results of the memory cell groups of each of the plurality of cell strings, and a program operation of programming the GIDL transistors of some of the plurality of cell strings.

    Non-volatile memory device
    3.
    发明授权

    公开(公告)号:US11200952B2

    公开(公告)日:2021-12-14

    申请号:US16991821

    申请日:2020-08-12

    Abstract: A non-volatile memory device comprises a memory cell region including a first metal pad, a peripheral circuit region including a second metal pad and vertically connected to the memory cell region by the first metal pad and the second metal pad, a memory cell array in the memory cell region including a plurality of memory cells, each of the memory cells being connected to a plurality of word lines in the memory cell region and a plurality of bit lines in the memory cell region, and a control logic circuit in the peripheral circuit region configured to control voltages to be applied to the plurality of word lines and the plurality of bit lines.

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