公开(公告)号：US11689793B2

公开(公告)日：2023-06-27

申请号：US17500326

申请日：2021-10-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyeongeun Lee ,  Yongwook Jang ,  Wonchul Cho

IPC: H04N5/335 ,  H04N23/55 ,  G02B7/02 ,  H04N23/45 ,  H04N23/54

CPC classification number: H04N23/55 ,  G02B7/021 ,  H04N23/45 ,  H04N23/54

Abstract: A camera module according to an embodiment of the disclosure may include: a Printed Circuit Board (PCB), a first image sensor and a second image sensor disposed on the PCB, a lens holder having an upper plate facing and spaced apart from the PCB and a sidewall extending from an edge of the upper plate toward the PCB, wherein the upper plate includes a first through-hole and a second through-hole aligned to the first image sensor and the second image sensor, respectively, a first lens assembly including a first lens system and a first barrel accommodating the first lens system, and assembled to the first through-hole to be aligned with the first image sensor, and a second lens assembly including a second lens system and a second barrel accommodating the second lens system, and assembled to the second through-hole to be aligned with the second image sensor. The first barrel may include a first sidewall coupled to the first through-hole and a second sidewall having a greater diameter than the first sidewall and located between the first through-hole and the first image sensor. The second barrel may include a third sidewall coupled to the second through-hole and a fourth sidewall having a greater diameter than the third sidewall and located between the second through-hole and the second image sensor.