公开(公告)号：US20230082912A1

公开(公告)日：2023-03-16

申请号：US17724568

申请日：2022-04-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wongi Chang ,  Dongkwan Kim ,  Jihan Ko ,  Jungseok Ryu ,  Youngmin Lee

IPC: H01L25/065

Abstract: A semiconductor package includes a circuit board including a wiring structure, first and second semiconductor chips disposed on the circuit board and connected to the wiring structure, a dummy chip disposed on the circuit board and positioned between the first and second semiconductor chips, and a molded member disposed on the circuit board and surrounding the first and second semiconductor chips and the dummy chip. The dummy chip may include a rounded edge between an upper surface and a side surface.