公开(公告)号：US11962069B2

公开(公告)日：2024-04-16

申请号：US17679284

申请日：2022-02-24

申请人： Samsung Electronics Co., Ltd.

发明人： Seokwoo Lee ,  Yeonghun Gu ,  Youngho Park ,  Jiwoo Lee ,  Kio Jung ,  Ko Choi ,  Woojin Choi

IPC分类号： H01Q1/24 ,  H01Q1/38 ,  H04M1/02 ,  H04M1/72454

CPC分类号： H01Q1/243 ,  H01Q1/245 ,  H01Q1/38 ,  H04M1/0277 ,  H04M1/72454

摘要： An electronic device is disclosed, including: a housing including a nonconductive area, a first printed circuit board (PCB) including a cavity and a fill-cut area, overlapping the nonconductive area, a first antenna module including at least one antenna array disposed in the cavity of the first PCB, a support frame coupled to one surface of the first PCB, supporting the first antenna module, a grip sensing pad surrounding the cavity and overlapping the fill-cut area, and a sensing circuit unit electrically connected to the grip sensing pad, configured to control an output power of the first antenna module based on inputs received via the grip sensing pad.

公开(公告)号：US11217517B2

公开(公告)日：2022-01-04

申请号：US16835915

申请日：2020-03-31

申请人： Samsung Electronics Co., Ltd.

发明人： Juhyeon Oh ,  Woojin Choi

IPC分类号： H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L25/10 ,  H01L23/482 ,  H01L23/14 ,  H01L25/065 ,  H01L23/528

摘要： A semiconductor package may include a substrate having an upper surface on which a plurality of first pads are disposed and a lower surface on which a plurality of second pads are disposed. The semiconductor package may further include a semiconductor chip disposed on the upper surface of the substrate on which connection electrodes connected to a first set of the plurality of first pads are disposed. The semiconductor package may include an interposer having an upper surface on which a plurality of first connection pads, connected to a second set of the plurality of first pads, and a plurality of second connection pads are disposed. The semiconductor package may further include a plurality of connection terminals disposed on a set of the plurality of second connection pads of the interposer, and a molding material disposed on the upper surface of the substrate.