公开(公告)号：US11973262B2

公开(公告)日：2024-04-30

申请号：US17570029

申请日：2022-01-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Woongsun Hong ,  Hongil Kwon

IPC: H01Q1/24 ,  H01Q1/38 ,  H01Q9/04 ,  H01Q13/10

CPC classification number: H01Q1/243 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q9/04 ,  H01Q9/0407 ,  H01Q13/10

Abstract: An electronic device is provided and includes a housing, a first substrate disposed in an inner space of the housing, a second substrate disposed on a first surface of the first substrate, a third substrate disposed on a first surface of the second substrate, a first conductive patch attached to at least a partial region of the side surfaces of the first substrate, the second substrate, and the third substrate, and a second conductive patch attached to at least another partial region of the side surfaces of the first substrate, the second substrate, and the third substrate.