公开(公告)号：US20240172371A1

公开(公告)日：2024-05-23

申请号：US18226568

申请日：2023-07-26

申请人： Samsung Electronics Co., Ltd.

发明人： JIHYUN LEE ,  HANSUNG RYU ,  YONG SUNG PARK ,  JUNHO LEE

IPC分类号： H05K3/34 ,  H01L21/48 ,  H01L23/498 ,  H01L23/522

CPC分类号： H05K3/3463 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/5226

摘要： A semiconductor package includes a first structure, a second structure, a plurality of first connection members including SnBi; a plurality of second connection members including SAC (Sn, Ag and Cu). Each first connection member of the plurality of first connection members has a first surface and a second surface opposite each other, and the first surface of each first connection member of the plurality of first connection members is bonded to the first structure. A third surface of each second connection member of a plurality of second connection members is bonded to a corresponding second surface of a respective first connection member, and for each second connection member, a fourth surface of the second connection member that is opposite the third surface of the second connection member is bonded to the second structure. The third surface of each second connection member is flat, and a diameter of each second connection member decreases in a direction receding from the third surface of each second connection member.