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公开(公告)号:US20210057536A1
公开(公告)日:2021-02-25
申请号:US16829372
申请日:2020-03-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: DOOHYUN LEE , HEONJONG SHIN , MINCHAN GWAK , HYUNHO PARK , SUNGHUN JUNG , YONGSIK JEONG , SANGWON JEE , INCHAN HWANG
IPC: H01L29/45 , H01L27/092 , H01L29/06 , H01L29/08 , H01L29/417 , H01L29/423 , H01L29/786 , H01L21/8238 , H01L29/66
Abstract: A semiconductor device including: a substrate that includes a first active region and a second active region; a first source/drain pattern on the first active region; a second source/drain pattern on the second active region; a separation dielectric pattern on the substrate between the first source/drain pattern and the second source/drain pattern; and a first contact pattern on the first source/drain pattern, wherein the first contact pattern includes: a first metal pattern; a first barrier pattern between the first metal pattern and the first source/drain pattern; and a second barrier pattern between the first barrier pattern and the first source/drain pattern, wherein the first barrier pattern contacts the separation dielectric pattern and extends along a sidewall of the first metal pattern adjacent to the separation dielectric pattern.
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公开(公告)号:US20220310809A1
公开(公告)日:2022-09-29
申请号:US17841873
申请日:2022-06-16
Applicant: Samsung Electronics Co., Ltd.
Inventor: Doohyun Lee , HYUN-SEUNG SONG , YEONGCHANG ROH , HEONJONG SHIN , SORA YOU , YONGSIK JEONG
IPC: H01L29/417 , H01L29/49 , H01L23/535 , H01L29/08 , H01L29/423 , H01L23/532
Abstract: A semiconductor device comprising a gate electrode on a substrate, a source/drain pattern on the substrate on a side of the gate electrode, and a gate contact plug on the gate electrode are disclosed. The gate contact plug may include a first gate contact segment, and a second gate contact segment that extends in a vertical direction from a top surface of the first gate contact segment. An upper width of the first gate contact segment may be greater than a lower width of the second gate contact segment.
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公开(公告)号:US20220020860A1
公开(公告)日:2022-01-20
申请号:US17488443
申请日:2021-09-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: DOOHYUN LEE , HEONJONG SHIN , MINCHAN GWAK , HYUNHO PARK , SUNGHUN JUNG , YONGSIK JEONG , SANGWON JEE , INCHAN HWANG
IPC: H01L29/45 , H01L29/66 , H01L29/06 , H01L29/08 , H01L29/417 , H01L29/423 , H01L29/786 , H01L21/8238 , H01L27/092
Abstract: A semiconductor device including: a substrate that includes a first active region and a second active region; a first source/drain pattern on the first active region; a second source/drain pattern on the second active region; a separation dielectric pattern on the substrate between the first source/drain pattern and the second source/drain pattern; and a first contact pattern on the first source/drain pattern, wherein the first contact pattern includes: a first metal pattern; a first barrier pattern between the first metal pattern and the first source/drain pattern; and a second barrier pattern between the first barrier pattern and the first source/drain pattern, wherein the first barrier pattern contacts the separation dielectric pattern and extends along a sidewall of the first metal pattern adjacent to the separation dielectric pattern.
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