公开(公告)号：US10999921B2

公开(公告)日：2021-05-04

申请号：US16007268

申请日：2018-06-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chan-Gi Park ,  Yikyu Min ,  Han Min Cho ,  Yeonsang Yun ,  Tae-Wook Ham

IPC: H05K1/02 ,  H05K5/00 ,  H01Q1/22 ,  H01P3/08 ,  H01Q21/28 ,  H01Q1/24 ,  H01P3/00 ,  H01Q9/04

Abstract: A circuit board is provided in which a transmission loss is reduced. The circuit board includes a first layer; a transmission line disposed on the first layer; and a second layer stacked with the first layer. The second layer includes a first region, which is constructed of a first material, corresponding to a position of the transmission line, and a second region, which is constructed of a second material having a permittivity that is different from that of the first material, corresponding to the position of the transmission line.