公开(公告)号：US20250054846A1

公开(公告)日：2025-02-13

申请号：US18633688

申请日：2024-04-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaesun Kim ,  Kwangsoo Kim ,  Yiseul Han

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L25/065 ,  H10B80/00

Abstract: Provided is a semiconductor package having a multi-chip package structure including a lower semiconductor chip and an upper semiconductor chip. The upper semiconductor chip includes a plurality of upper semiconductor chips, and one of the plurality of upper semiconductor chips is integrally connected to an adjacent one of the plurality of upper semiconductor chips with a scribe lane therebetween on a same plane.