公开(公告)号：US20250022899A1

公开(公告)日：2025-01-16

申请号：US18440696

申请日：2024-02-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seokho YUN ,  Sookyoung Roh ,  Daekwan Kim ,  Yohwan Noh ,  Jangho Moon

IPC: H01L27/146 ,  G02B3/00

Abstract: An image sensor includes a sensor substrate including a plurality of pixels that are two-dimensionally disposed in a first direction and a second direction; and a nano-photonic lens array including a first pixel corresponding region, a second pixel corresponding region, a third pixel corresponding region, and a fourth pixel corresponding region respectively corresponding to the plurality of pixels, wherein each of the first to fourth pixel corresponding regions includes a plurality of nano-structures that are arranged to condense light of a first wavelength, light of a second wavelength, and light of a third wavelength respectively onto the plurality of pixels, and in each of the second pixel corresponding region and the fourth pixel corresponding region, cross-sectional area sizes of the plurality of nano-structures are distributed asymmetrically in the first direction, the second direction, and a first diagonal direction, and are distributed symmetrically in a second diagonal direction that crosses the first diagonal direction.

公开(公告)号：US11532657B2

公开(公告)日：2022-12-20

申请号：US16855384

申请日：2020-04-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daekwan Kim ,  Yohwan Noh ,  Chaesung Kim ,  Keunyung Byun

IPC: H01L27/146 ,  G02B5/20 ,  G02B3/00 ,  H04N5/335

Abstract: An image sensor includes a plurality of pixels configured to receive an optical signal incident through a first lens portion; a planarization layer that has a same refractive index as a refractive index of the first lens portion; a second lens portion that is configured to classify the optical signal incident through the first lens portion according to an incidence angle, and is configured to deliver the optical signal to each of the plurality of pixels; and image processing circuitry configured to generate a subject image by combining one or more subimages obtained from the optical signal, wherein the planarization layer is arranged between the second lens portion and the plurality of pixels.

公开(公告)号：US11178326B2

公开(公告)日：2021-11-16

申请号：US16786572

申请日：2020-02-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yohwan Noh ,  Daekwan Kim ,  Chaesung Kim ,  Tae-Shick Wang

IPC: H04N5/232 ,  H04N5/225 ,  H04N5/369 ,  H04N9/04 ,  H04N9/07 ,  H01L27/146 ,  G02B7/36

Abstract: Provided is an image sensor including a pixel array including a plurality of pixels, and a micro lens array including a first micro lens of a first size provided in a first area of the pixel array and a second micro lens of a second size provided in a second area of the pixel array, the second size being different from the first size.

公开(公告)号：US11675112B2

公开(公告)日：2023-06-13

申请号：US16806011

申请日：2020-03-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyunghwan Lee ,  Daekwan Kim ,  Yohwan Noh

IPC: G02B3/00 ,  G06V40/13 ,  G06V10/10 ,  G06V40/12

CPC classification number: G02B3/0062 ,  G06V10/17 ,  G06V40/1318 ,  G06V40/1324 ,  G06V40/1341

Abstract: An electronic device includes a substrate, a plurality of light sources, the plurality of light sources configured to emit an optical signal to an object through the substrate, at least one sensor underneath the substrate, the at least one sensor configured to detect biometric information associated with the object by receiving a reflected light signal, the reflected light signal corresponding to the optical signal reflected off the object and transferred through the substrate, and a multi-lens array including at least one support layer, a plurality of first lenses, and a plurality of second lenses, the at least one support layer in an upper portion of the at least one sensor, the plurality of first lenses on an upper surface of the at least one support layer, and the plurality of second lenses on a lower surface of the at least one support layer.

公开(公告)号：US11563883B2

公开(公告)日：2023-01-24

申请号：US17496196

申请日：2021-10-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yohwan Noh ,  Daekwan Kim ,  Chaesung Kim ,  Tae-Shick Wang

IPC: H04N5/232 ,  H04N5/225 ,  H04N5/369 ,  H04N5/374 ,  G02B7/36 ,  H01L27/146

Abstract: Provided is an image sensor including a pixel array including a plurality of pixels, and a micro lens array including a first micro lens of a first size provided in a first area of the pixel array and a second micro lens of a second size provided in a second area of the pixel array, the second size being different from the first size.

公开(公告)号：US10271000B2

公开(公告)日：2019-04-23

申请号：US15175748

申请日：2016-06-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yohwan Noh ,  Chaesung Kim

IPC: H04N5/378 ,  H01L27/146 ,  H04N5/345 ,  H04N9/04

Abstract: Disclosed is an image sensor module which includes a pixel array including a plurality of sub-pixels arranged along a plurality of rows and a plurality of columns, an analog to digital converter connected to the pixel array through a plurality of data lines and converting signals output from the plurality of sub-pixels into digital signals, a row decoder connected to the pixel array through a plurality of selection lines, a plurality of transfer lines, and a plurality of reset lines, and a control logic circuit controlling the analog to digital converter and the row decoder to allow a plurality of sub-frames to be sequentially outputted from the plurality of sub-pixels, wherein each of the plurality of sub-frames is generated based on signals output from different sub-pixels among the plurality of sub-pixels.

公开(公告)号：US11363230B2

公开(公告)日：2022-06-14

申请号：US17308421

申请日：2021-05-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yohwan Noh ,  Chaesung Kim

IPC: H04N5/378 ,  H01L27/146 ,  H04N5/345 ,  H04N9/04 ,  H04N5/369

Abstract: Disclosed is an image sensor module which includes a pixel array including a plurality of sub-pixels arranged along a plurality of rows and a plurality of columns, an analog to digital converter connected to the pixel array through a plurality of data lines and converting signals output from the plurality of sub-pixels into digital signals, a row decoder connected to the pixel array through a plurality of selection lines, a plurality of transfer lines, and a plurality of reset lines, and a control logic circuit controlling the analog to digital converter and the row decoder to allow a plurality of sub-frames to be sequentially outputted from the plurality of sub-pixels, wherein each of the plurality of sub-frames is generated based on signals output from different sub-pixels among the plurality of sub-pixels.

公开(公告)号：US11064148B2

公开(公告)日：2021-07-13

申请号：US16375961

申请日：2019-04-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yohwan Noh ,  Chaesung Kim

IPC: H04N5/378 ,  H01L27/146 ,  H04N5/345 ,  H04N9/04 ,  H04N5/369

Abstract: Disclosed is an image sensor module which includes a pixel array including a plurality of sub-pixels arranged along a plurality of rows and a plurality of columns, an analog to digital converter connected to the pixel array through a plurality of data lines and converting signals output from the plurality of sub-pixels into digital signals, a row decoder connected to the pixel array through a plurality of selection lines, a plurality of transfer lines, and a plurality of reset lines, and a control logic circuit controlling the analog to digital converter and the row decoder to allow a plurality of sub-frames to be sequentially outputted from the plurality of sub-pixels, wherein each of the plurality of sub-frames is generated based on signals output from different sub-pixels among the plurality of sub-pixels.

公开(公告)号：US20210049340A1

公开(公告)日：2021-02-18

申请号：US16806011

申请日：2020-03-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyunghwan LEE ,  Daekwan Kim ,  Yohwan Noh

IPC: G06K9/00 ,  G02B3/00

Abstract: An electronic device includes a substrate, a plurality of light sources, the plurality of light sources configured to emit an optical signal to an object through the substrate, at least one sensor underneath the substrate, the at least one sensor configured to detect biometric information associated with the object by receiving a reflected light signal, the reflected light signal corresponding to the optical signal reflected off the object and transferred through the substrate, and a multi-lens array including at least one support layer, a plurality of first lenses, and a plurality of second lenses, the at least one support layer in an upper portion of the at least one sensor, the plurality of first lenses on an upper surface of the at least one support layer, and the plurality of second lenses on a lower surface of the at least one support layer.