公开(公告)号：US20240213128A1

公开(公告)日：2024-06-27

申请号：US18529346

申请日：2023-12-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jihyun LEE ,  Yongsung PARK

IPC: H01L23/498 ,  H01L23/31 ,  H05K1/18

CPC classification number: H01L23/49816 ,  H01L23/3128 ,  H01L23/49838 ,  H05K1/181 ,  H05K2201/10734

Abstract: A semiconductor package includes a wiring substrate, a solder ball on a lower surface of the wiring substrate, a ball land between the lower surface of the wiring substrate and the solder ball and having an upper surface having a circular shape, and a mask layer covering the lower surface of the wiring substrate and including an opening through which a portion of the ball land is exposed. The ball land includes a first land region which is exposed via the opening and has an upper surface having a semicircular shape with a first radius and a second land region which is integrated with a flat side surface of the first land region and has an upper surface having a semicircular shape with a second radius that is less than the first radius.