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公开(公告)号:US20240213128A1
公开(公告)日:2024-06-27
申请号:US18529346
申请日:2023-12-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jihyun LEE , Yongsung PARK
IPC: H01L23/498 , H01L23/31 , H05K1/18
CPC classification number: H01L23/49816 , H01L23/3128 , H01L23/49838 , H05K1/181 , H05K2201/10734
Abstract: A semiconductor package includes a wiring substrate, a solder ball on a lower surface of the wiring substrate, a ball land between the lower surface of the wiring substrate and the solder ball and having an upper surface having a circular shape, and a mask layer covering the lower surface of the wiring substrate and including an opening through which a portion of the ball land is exposed. The ball land includes a first land region which is exposed via the opening and has an upper surface having a semicircular shape with a first radius and a second land region which is integrated with a flat side surface of the first land region and has an upper surface having a semicircular shape with a second radius that is less than the first radius.