公开(公告)号：US20240417593A1

公开(公告)日：2024-12-19

申请号：US18596020

申请日：2024-03-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Woosung Jeon ,  Yongtae Park ,  Doyoon Kim ,  Jaehoon Ryu ,  Sunjae Jang ,  Sungsik Jo

IPC: C09G1/02

Abstract: Provided is a slurry composition for chemical mechanical polishing (CMP) including an organic abrasive material that includes a supramolecular compound (e.g., supramolecular assembly), an analog thereof, or a derivative thereof. The slurry composition for chemical mechanical polishing may reduce or prevent CMP-induced defects, thereby reducing or suppressing product defects with a higher polishing selectivity.