公开(公告)号：US10930593B2

公开(公告)日：2021-02-23

申请号：US16413039

申请日：2019-05-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young Kwan Lee ,  Yun Tae Lee ,  Young Sik Hur ,  Ho Kwon Yoon ,  Won Wook So

IPC: H01L23/528 ,  H01L25/16 ,  H01L23/00 ,  H01L23/31 ,  H01L23/522

Abstract: A package-on-package includes a first semiconductor package including a first semiconductor chip and a second semiconductor package, disposed on the first semiconductor package, including a second semiconductor chip electrically connected to the first semiconductor chip. Each of the first and second semiconductor chips includes one or more units. The number of units of the first semiconductor chip is greater than the number of units of the second semiconductor chip. The one or more units of the first semiconductor chip and the one or more units of the second semiconductor chip implement a function of an application processor chip.

公开(公告)号：US09458126B2

公开(公告)日：2016-10-04

申请号：US14751713

申请日：2015-06-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byung Hee Sohn ,  Young Kwan Lee ,  Yi Yoiung Yun ,  Won Jae Joo

IPC: C07D333/22 ,  H01B1/12 ,  H01B1/22

CPC classification number: C07D333/22 ,  H01B1/127 ,  H01B1/22 ,  Y10T428/294

Abstract: Disclosed herein is a monomer for binding nano-metal, which is useful for the preparation of a conductor having increased conductivity with ensuring flexibility and transparency. Polymerization of the monomer for binding nano-metal provides a conductive polymer composite including a nano-metal rod. A method of preparing the conductive polymer composite is also provided.

Abstract translation: 本文公开了用于结合纳米金属的单体，其可用于制备具有增加的导电性并且确保柔性和透明度的导体。 用于结合纳米金属的单体的聚合提供了包括纳米金属棒的导电聚合物复合材料。 还提供了制备导电聚合物复合材料的方法。