公开(公告)号：US11871541B2

公开(公告)日：2024-01-09

申请号：US17673099

申请日：2022-02-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hongki Moon ,  Kyungha Koo ,  Yoonsun Park ,  Youngjae You ,  Hyunjoo Lee ,  Joseph Ahn

IPC: H05K7/20

CPC classification number: H05K7/20327 ,  H05K7/2099 ,  H05K7/20336 ,  H05K7/20963

Abstract: An electronic device may include: a housing, a support member disposed in an internal space of the housing and including a first surface and a second surface facing a direction opposite the first surface, wherein the support member includes a through hole in at least a portion thereof, and a vapor chamber disposed through at least a portion of the through-hole, wherein the vapor chamber may include: a first plate including a first plate portion including a plurality of pillars and a first flange portion extending along an edge of the first plate portion to have a first width, a second plate having a size corresponding to the first plate portion and including a second plate portion including a recess and a second flange portion extending along an edge of the second plate portion to have a second width less than the first width, and at least one wick disposed in the recess, wherein the wick may be accommodated through a closed space defined through coupling of the first plate and the second plate.

公开(公告)号：US11357142B2

公开(公告)日：2022-06-07

申请号：US16899118

申请日：2020-06-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunjoong Yoon ,  Myunghoon Kwak ,  Minki Park ,  Youngjae You ,  Yongsang Yun

IPC: H05K9/00 ,  H05K7/20 ,  H01L23/40 ,  H05K1/02 ,  H01L23/552

Abstract: An electronic device having a shielding structure disposed around electronic components and having high heat dissipation performance is provided. The electronic device includes a circuit board, at least one electronic component mounted on a surface of the circuit board, a shielding sheet attached to the surface of the circuit board to cover the at least one electronic component, a thermal interface material stacked on the shielding sheet to overlap the at least one electronic component, and a heat dissipation member disposed to face the surface of the circuit board, being in surface contact with the thermal interface material, and fastened to at least a portion of the circuit board by a fixing member. Various other embodiments may be possible.