公开(公告)号：US20230269315A1

公开(公告)日：2023-08-24

申请号：US18310096

申请日：2023-05-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangha LEE ,  Soonho HWANG ,  Seongjin PARK ,  Hyeonuk KANG ,  Youngjoon LIM

IPC: H04M1/02 ,  H01Q1/24 ,  H01Q21/06

CPC classification number: H04M1/0216 ,  H01Q1/243 ,  H01Q21/065 ,  H04M1/0268 ,  H04M1/0262

Abstract: An electronic device may include: a first housing; a second housing coupled to the first housing through a hinge; an antenna module; and at least one processor electrically coupled to the antenna module, wherein the hinge is arranged about a first axis in an area having a first width in a third direction which is perpendicular to each of a first direction and to a second direction, which is perpendicular to the first direction and is faced by the rear side of the first housing, and the first housing has a first structure, and an arrangement portion is provided in the first structure, and the at least one processor may be configured to transmit and/or receive a signal having a frequency between 3 GHz and 100 GHz in the first direction or in a direction between the second direction and the third direction, by using the antenna module.

公开(公告)号：US20250125514A1

公开(公告)日：2025-04-17

申请号：US18990735

申请日：2024-12-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngjoon LIM ,  Hyeonuk KANG ,  Hosaeng KIM ,  Sangha LEE ,  Jaehoo JO ,  Soonho HWANG

IPC: H01Q1/22 ,  H01Q19/10

Abstract: According to various embodiments, an electronic device may include at least one housing including a rear cover, a conductive structure disposed in an inner space of the at least one housing, and a first antenna structure in the inner space, the first antenna structure including a substrate including a first substrate surface and a second substrate surface facing in an opposite direction to the first substrate surface; and a plurality of antenna elements disposed on the substrate. The plurality of antenna elements are configured to transmit signals in a direction towards the conductive structure. The first antenna structure may be disposed such that the first substrate surface faces in a first direction so as to face the conductive structure. The conductive structure is configured to change direction of the signals transmitted by the plurality of antenna elements to form a beam pattern through the rear cover.

公开(公告)号：US20230178901A1

公开(公告)日：2023-06-08

申请号：US18106245

申请日：2023-02-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongyeon KIM ,  Minsoo KIM ,  Hosaeng KIM ,  Youngsuk YOO ,  Woosup LEE ,  Sukgi HONG ,  Haeyeon KIM ,  Youngjoon LIM

IPC: H01Q21/06 ,  H01Q9/04

CPC classification number: H01Q21/065 ,  H01Q9/0414

Abstract: An ultra-wide band (UWB) antenna including a dielectric substrate, and first and second conductive layers arranged on opposite sides of the dielectric substrate. The first conductive layer includes a first, second and third patch antennae, each configured to receive a first UWB signal and a second UWB signal, wherein the second and third patch antennae are spaced apart from the first patch antenna in specific directions. The first conductive layer also includes first, second, and third transmission lines connecting, respectively, the first, second, and third patch antennae to a connector. The second conductive layer includes a ground pattern overlapping the first, second, and third patch antennae and the first, second, and third transmission lines, when facing the second conductive layer in a third direction that is perpendicular to the first direction and the second direction.

公开(公告)号：US20230092046A1

公开(公告)日：2023-03-23

申请号：US17994147

申请日：2022-11-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngjoon LIM ,  Haeyeon KIM ,  Shinho YOON ,  Soonho HWANG

IPC: H01Q1/24 ,  H01Q9/04 ,  H01Q21/08 ,  H01Q1/42

Abstract: An electronic device is provided. The electronic device includes a first frame, a first opening formed in a first area of the first frame, a first antenna module, a cover that includes a first dielectric material and a second dielectric material and is disposed in the first area of the first frame, and a first wireless communication circuit. The first dielectric material includes an engagement groove, and the second dielectric material includes a protrusion corresponding to the engagement groove. The first dielectric material and the second dielectric material may come into contact as the protrusion of the second dielectric material engages with the engagement groove of the first dielectric material.