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1.
公开(公告)号:US20220418135A1
公开(公告)日:2022-12-29
申请号:US17847871
申请日:2022-06-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Yoonhee LEE , Youngoh KIM , Juncheol SHIN , Seungchang BAEK , Sungho CHO , Hangyu HWANG
IPC: H05K5/04
Abstract: A housing of an electronic device includes two or more metal portions, each having an oxide film layer formed on a surface thereof, and a non-conductive portion formed to cover at least a portion of the oxide film layer.
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公开(公告)号:US20250097334A1
公开(公告)日:2025-03-20
申请号:US18959098
申请日:2024-11-25
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jongmoon PARK , Youngoh KIM , Junghan KIM , Hyungki PARK , Kidoc SON , Hyunsuk CHOI
IPC: H04M1/02
Abstract: According to various embodiments of the present disclosure, an anodized aluminum plate may be provided, the anodized aluminum plate including a first region and a second region connected to the first region, wherein the first region includes at least one first pore having a first diameter, the second region includes a first second region connected to the first region and a second second region extending from the first second region, and the first second region includes at least one second pore having a second diameter less than the first diameter.
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