公开(公告)号：US20250096201A1

公开(公告)日：2025-03-20

申请号：US18599390

申请日：2024-03-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gyujin CHOI ,  Dahee KIM ,  Hwan Pil PARK ,  Taehoon LEE ,  Younjeong CHOE

IPC: H01L25/065 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L25/16

Abstract: The present disclosure relates to a semiconductor package which includes a wiring structure including insulating layers, wiring layers, and vias, a chip stack structure including a plurality of semiconductor chips and being oblique on the wiring structure such that the plurality of semiconductor chips are inclined with respect to the wiring structure, and a sealing material encapsulating the chip stack structure, wherein each of the plurality of semiconductor chips includes connection pads on one surface of the semiconductor chip, and the plurality of semiconductor chips are being offset with each other such that the connection pads are exposed, and each of the connection pads of each of the plurality of semiconductor chips is in contact with one of the vias and connected to the wiring layers.