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公开(公告)号：US09630440B2
公开(公告)日：2017-04-25
申请号：US14078763
申请日：2013-11-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ki-yeon Yang , Yun-Woo Nam
IPC: B41F27/00 , B41N6/00 , H01L21/683
CPC classification number: B41N6/00 , H01L21/6838
Abstract: A stamp structure includes a stamp frame having a plate part. The plate part includes a plurality of holes. The plurality of holes are configured to facilitate the adsorption of an object to the plate part during a transfer of the object from a donor substrate to a target substrate.
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