公开(公告)号：US20250096211A1

公开(公告)日：2025-03-20

申请号：US18963643

申请日：2024-11-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangnam JEONG ,  Yunhee LEE

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065

Abstract: Provided are an integrated voltage regulator (IVR) package with a minimized size including one or more inductors and one or more capacitors together with an IVR chip and improving characteristics of a voltage regulator (VR), and an IVR system package including the IVR package. The IVR package includes a package substrate, a stacked structure mounted on the package substrate and having a stack structure in which a passive device chip including one or more capacitors and an IVR chip including a voltage regulator are stacked, and an intermediate substrate disposed on the package substrate in a structure surrounding the stacked structure, the intermediate substrate including vias therein. The one or more inductors are included in the stacked structure or the intermediate substrate.

公开(公告)号：US20230253381A1

公开(公告)日：2023-08-10

申请号：US17947113

申请日：2022-09-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangnam JEONG ,  Yunhee LEE

IPC: H01L25/16 ,  H01L23/498

CPC classification number: H01L25/16 ,  H01L25/162 ,  H01L23/49833 ,  H01L25/0657

Abstract: Provided are an integrated voltage regulator (IVR) package with a minimized size including one or more inductors and one or more capacitors together with an IVR chip and improving characteristics of a voltage regulator (VR), and an IVR system package including the IVR package. The IVR package includes a package substrate, a stacked structure mounted on the package substrate and having a stack structure in which a passive device chip including one or more capacitors and an IVR chip including a voltage regulator are stacked, and an intermediate substrate disposed on the package substrate in a structure surrounding the stacked structure, the intermediate substrate including vias therein. The one or more inductors are included in the stacked structure or the intermediate substrate.