公开(公告)号：US20180273816A1

公开(公告)日：2018-09-27

申请号：US15933630

申请日：2018-03-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minchul LEE ,  Namil KOO ,  Kyungrim KIM ,  Sun-Woo PARK ,  Yongin PARK ,  Min-Woo LEE ,  Wonhee CHOE ,  Hun Rae KIM ,  Dong-Sel KIM ,  Zeeyoung LEE

IPC: C09J183/10 ,  C09J133/06 ,  C08J3/24 ,  C08F20/18 ,  H01L21/02 ,  C08K3/36

CPC classification number: C09J183/10 ,  C08F20/18 ,  C08F220/18 ,  C08F2500/01 ,  C08J3/246 ,  C08K3/36 ,  C09J133/06 ,  C09J133/08 ,  H01L21/02118 ,  C08F2220/1825 ,  C08F2220/1858 ,  C08F2220/1875 ,  C08F220/20 ,  C08L83/06

Abstract: Provided are a composition for adhesion, a stacked structure including the same, and an electronic device including the same. The composition for adhesion may include an acrylic resin and a silane compound. The acrylic resin may have a weight average molecular weight of about 100,000 g/mol to about 200,000 g/mol, and may include a polymerization unit derived from a monomer represented by Formula A1 and a polymerization unit derived from a monomer represented by Formula A2. The silane compound may have a weight average molecular weight of about 300 g/mol to about 2,000 g/mol, and a polymerization unit derived from a monomer represented by Formula B.