公开(公告)号：US20230097611A1

公开(公告)日：2023-03-30

申请号：US18057397

申请日：2022-11-21

Applicant: Samsung Electronics co., Ltd.

Inventor： Jihun CHEON ,  Hyun Jung Lee ,  Pyojin Jeon ,  Yong-Jhin Cho ,  Wonjun Lee

IPC: H01L21/67 ,  B08B7/00 ,  B08B3/02 ,  B08B7/04 ,  G03F7/30 ,  B08B5/02

Abstract: An apparatus for fabricating a semiconductor device may include a nozzle having a slit configured to eject solution and an ultraviolet emitter provided outside the nozzle. The ultraviolet emitter and the nozzle may be configured to move horizontally. The slit may be provided on a bottom surface of the nozzle.