公开(公告)号：US12244084B2

公开(公告)日：2025-03-04

申请号：US17768681

申请日：2020-11-12

Applicant: Samtec, Inc.

Inventor： Christina Kozlovsky ,  Jignesh H. Shah ,  Eric J. Zbinden

IPC: H01R12/70 ,  H01R12/71 ,  H01R12/75 ,  H01R13/6583 ,  H04B1/38

Abstract: An interconnection system is configured to be carried by a substrate and includes a cage that is configured to be connected to the substrate, that includes a first end and a second end opposed to the first end, and that is configured to receive an interconnection module; and an electrical connector located at the second end of the cage. The electrical connector includes a fixed connector that is configured to be rigidly attached to the substrate and a detachable connector that is configured to be mated and unmated from the fixed connector.