公开(公告)号：US11621523B2

公开(公告)日：2023-04-04

申请号：US17486058

申请日：2021-09-27

Applicant: Samtec, Inc.

Inventor： Keith R. Guetig ,  Thomas A. Hall, III ,  Andrew R. Collingwood ,  John L. Nightingale ,  Eric J. Zbinden

IPC: H01R13/631 ,  H01R13/26 ,  H01R13/52

Abstract: A cage assembly includes a cage including a top wall and a bottom wall and an electrical receptacle positioned between the top wall and the bottom wall such that the electrical receptacle floats within the cage in opposite directions between the top wall and the bottom wall.

公开(公告)号：US11177614B2

公开(公告)日：2021-11-16

申请号：US16619246

申请日：2018-06-06

Applicant: Samtec, Inc.

Inventor： Keith R. Guetig ,  Thomas A. Hall, III ,  Andrew R. Collingwood ,  John L. Nightingale ,  Eric J. Zbinden

IPC: H01R13/631 ,  H01R13/26 ,  H01R13/52

Abstract: A cage assembly includes a cage including a top wall and a bottom wall and an electrical receptacle positioned between the top wall and the bottom wall such that the electrical receptacle floats within the cage in opposite directions between the top wall and the bottom wall.

公开(公告)号：US10466433B2

公开(公告)日：2019-11-05

申请号：US16016979

申请日：2018-06-25

Applicant: Samtec, Inc.

Inventor： Marc Epitaux ,  Joshua R. Cornelius ,  John L. Nightingale

IPC: G02B6/42 ,  G02B6/36 ,  G02B6/12 ,  G02B6/138 ,  G02B6/293 ,  G02B6/122 ,  G02B6/124

Abstract: An optical module includes a Silicon Photonics chip that transports a light signal and a coupler chip that includes a waveguide and that is attached to the Silicon Photonics chip so that the light signal is transported along a light path between the Silicon Photonics chip and the coupler chip. The light path in the coupler chip includes a guided section that includes the waveguide that guides the light signal and an unguided section that does not guide the light signal in any other waveguide structure. The cross-sectional size of the beam defined by the light signal is largest at the interface between the Silicon Photonics chip and the coupler chip.

公开(公告)号：US20200310054A1

公开(公告)日：2020-10-01

申请号：US16900097

申请日：2020-06-12

Applicant: Samtec, Inc.

Inventor： Marc Epitaux ,  John L. Nightingale

IPC: G02B6/42 ,  G02B6/35

Abstract: An optical transceiver can include a transmitter having a photonic integrated circuit, and a receiver having a current-to-voltage converter and a photodetector in electrical communication with the current-to-voltage converter and separate from the photonic integrated circuit. Each of the transmitter and the receiver can include an interconnect member that includes first and second optical paths for the propagation of optical transmit signals and optical receive signals, respectively. The interconnect members of the transmitter and receiver can further define electrical paths that are configured to connect to an underlying substrate at one end, and the transmitter and receiver, respectively. The interconnect members can be separate from each other or can define a single monolithic interconnect member.