METHOD OF FABRICATING POROUS FILM STRUCTURE USING DRY PROCESSES AND POROUS FILM STRUCTURES FABRICATED BY THE SAME
    1.
    发明申请
    METHOD OF FABRICATING POROUS FILM STRUCTURE USING DRY PROCESSES AND POROUS FILM STRUCTURES FABRICATED BY THE SAME 审中-公开
    使用干法处理多孔膜结构的方法和由此制成的多孔膜结构

    公开(公告)号:US20130052475A1

    公开(公告)日:2013-02-28

    申请号:US13589416

    申请日:2012-08-20

    IPC分类号: C22C3/00 B32B15/00

    CPC分类号: C22C3/00 Y10T428/12431

    摘要: Provided are a method of fabricating a porous thin film structure, by forming a thin film from at least two elements, followed by selectively removing the certain element using a dry etching process, and a porous thin film structure fabricated by the same. Because all processes of the method of fabricating a porous thin film structure are dry processes, process control is simply accomplished, environmental impact is low, and mass production is possible, in contrast to when using a typical wet process such as electrodeposition or dealloying. Also, since a level of porosity is easily controlled and maintained uniform, a mesoporous thin film structure showing a reproducible level of sensitivity when used as a sensor can be fabricated.

    摘要翻译: 提供一种制造多孔薄膜结构的方法,通过从至少两个元素形成薄膜,然后使用干蚀刻工艺选择性地去除某些元素,以及由其制造的多孔薄膜结构。 由于制造多孔薄膜结构的方法的所有方法都是干法,与使用典型的湿法如电沉积或脱合金相比,简单地实现了过程控制,环境影响低,大量生产是可能的。 此外,由于可以容易地控制和保持孔隙度的水平,所以可以制造当用作传感器时显示出可重现的灵敏度水平的介孔薄膜结构。