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公开(公告)号:US20090021921A1
公开(公告)日:2009-01-22
申请号:US11114342
申请日:2005-04-26
申请人: Sang Jae Jang , Chul Woo Park , Suk Ku Ko , Choon Heung Lee
发明人: Sang Jae Jang , Chul Woo Park , Suk Ku Ko , Choon Heung Lee
IPC分类号: H05K1/14
CPC分类号: H05K3/284 , H01L23/3121 , H01L23/3135 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49109 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H05K1/0266 , H05K1/117 , H05K3/0052 , H05K2201/09145 , H05K2201/0989 , H05K2201/10159 , H05K2203/0191 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A memory card comprising a circuit board having opposed upper and lower circuit board surfaces, multiple side edges, a chamfer extending between a pair of the side edges, a plurality of pads disposed on the lower circuit board surface, and a conductive pattern which is disposed on the upper circuit board surface and electrically connected to the pads. At least one electronic circuit device is attached to the upper circuit board surface and electrically connected to the conductive pattern of the circuit board. A body at least partially encapsulates the circuit board and the electronic circuit element such that a section of the upper circuit board surface extending along the entirety of the chamfer is not covered by the body.
摘要翻译: 一种存储卡,包括具有相对的上电路板表面和下电路板表面的电路板,多个侧边缘,在一对侧边缘之间延伸的倒角,设置在下电路板表面上的多个焊盘和设置在下电路板表面上的导电图案 在上电路板表面上并电连接到焊盘。 至少一个电子电路装置附接到上电路板表面并电连接到电路板的导电图案。 主体至少部分地封装电路板和电子电路元件,使得沿整个倒角延伸的上部电路板表面的一部分不被主体覆盖。