公开(公告)号：USD916039S1

公开(公告)日：2021-04-13

申请号：US29728654

申请日：2020-03-20

申请人： Sansha Electric Manufacturing Co., Ltd.

设计人： Tomohiro Yamanaka ,  Yoichi Makimoto

公开(公告)号：US11935820B2

公开(公告)日：2024-03-19

申请号：US17413962

申请日：2020-11-20

申请人： Sansha Electric Manufacturing Co., Ltd.

发明人： Tomohiro Yamanaka ,  Yoichi Makimoto

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L25/07 ,  H01L25/18

CPC分类号： H01L23/49568 ,  H01L23/3121 ,  H01L23/49524 ,  H01L23/49555 ,  H01L23/49575 ,  H01L25/072 ,  H01L25/18

摘要： An object is to suppress a lift of an external terminal when an external force is applied, thereby improving the reliability of a semiconductor device. A heat radiating plate 10 having on one main surface a circuit area 54 in which a semiconductor element 50 is arranged, a pair of terminals 31 and 32 connected to the semiconductor element 50, a resin housing 20 that covers the circuit area 54 of the heat radiating plate 10 to seal the semiconductor element 50, and has a terminal surface 22 formed on an upper surface, a pair of side surfaces in the longitudinal direction, and a pair of front and rear surfaces in the lateral direction, are included. The resin housing 20 has a pair of bending contact portions 22e and 23e that come into respectively contact with the pair of terminals 31 and 32 to define bending positions of the terminals 31 and 32. The pair of bending contact portions 22e and 23e are formed to have different heights. The pair of terminals 31 and 32 protrude from the resin housing 20 at positions sandwiching the nut accommodating opening 21, and are bent so as to overlap each other on the nut accommodating opening 21.