公开(公告)号：US20050164481A1

公开(公告)日：2005-07-28

申请号：US11088311

申请日：2005-03-23

申请人： Scott Deboer ,  Vishnu Agarwal

发明人： Scott Deboer ,  Vishnu Agarwal

IPC分类号： H01L21/02 ,  H01L21/768 ,  H01L21/8242 ,  H01L23/528 ,  H01L27/108 ,  H01L21/44

CPC分类号： H01L27/10855 ,  H01L21/76895 ,  H01L23/5283 ,  H01L27/10811 ,  H01L27/10888 ,  H01L28/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： An intermediate metal plug is used to raise the platform to which contact is to be made. In the illustrated process, a partial bit line plug is formed adjacent a stacked capacitor, and an interlevel dielectric formed over the capacitor. The bit line contact is completed by extending a via from the bit line, formed above the interlevel dielectric, down to the level of the intermediate plug, and the via is filled with metal. The height of the via to be filled is thus reduced by the height of the intermediate plug. In one embodiment, the intermediate plug is slightly shorter than an adjacent container-shaped capacitor. In another embodiment, the intermediate plug is about as high as an adjacent stud capacitor.