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公开(公告)号:US06150713A
公开(公告)日:2000-11-21
申请号:US260471
申请日:1999-03-02
申请人: Se-chul Park , Kyu-han Lee , Ju-bong Kim , Sung-il Kang , Dong-il Shin , Bae-soon Jang
发明人: Se-chul Park , Kyu-han Lee , Ju-bong Kim , Sung-il Kang , Dong-il Shin , Bae-soon Jang
IPC分类号: H01L23/50 , H01L21/48 , H01L23/495
CPC分类号: H01L23/49582 , C25D5/16 , C25D5/18 , H01L21/4821 , H01L2224/48247 , H01L2224/85464 , H01L24/48 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/14
摘要: A lead frame plating method including the steps of (a) forming an intermediate layer on the upper surface of a metal substrate, (b) submerging the metal substrate into a plating solution, and (c) forming a passive layer to a thickness of 0.01 to 1.5 microinches on the upper surface of the intermediate layer by applying a modulated current to the plating solution and the metal substrate.
摘要翻译: 一种引线框架电镀方法,包括以下步骤:(a)在金属基板的上表面上形成中间层,(b)将金属基板浸入电镀液中,(c)形成钝化层,厚度为0.01 通过向电镀溶液和金属基底施加调制电流至中间层的上表面上的1.5微英寸。