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1.发明申请公开(公告)号：US20190381629A1
公开(公告)日：2019-12-19
申请号：US16434853
申请日：2019-06-07
Applicant: Seagate Technology LLC
Inventor： Edwin Rejda , Andrew Habermas , Jeff O'Konski , Andrew Sherve , Michael Thomas Johnson , Dongming Liu
Abstract: The present disclosure includes methods of lapping that include energizing one or more elements that are located proximal to a first magnetoresistive element in a transducer region and generate heat and cause the first magnetoresistive element to selectively expand in the lapping direction relative to one or more other magnetoresistive elements. The present disclosure also includes methods of lapping that use one or more thermal sensors located proximal to the first magnetoresistive element to help control lapping in the lapping direction. The present disclosure includes related lapping systems and sliders.
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Patent Agency Ranking
2.发明申请公开(公告)号：US20220234166A1
公开(公告)日：2022-07-28
申请号：US17720847
申请日：2022-04-14
Applicant: Seagate Technology LLC
Inventor： Edwin Rejda , Andrew Habermas , Jeff O'Konski , Andrew Sherve , Michael Thomas Johnson , Dongming Liu
Abstract: The present disclosure includes methods of lapping that include energizing one or more elements that are located proximal to a first magnetoresistive element in a transducer region and generate heat and cause the first magnetoresistive element to selectively expand in the lapping direction relative to one or more other magnetoresistive elements. The present disclosure also includes methods of lapping that use one or more thermal sensors located proximal to the first magnetoresistive element to help control lapping in the lapping direction. The present disclosure includes related lapping systems and sliders.
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3.发明授权公开(公告)号：US11691242B2
公开(公告)日：2023-07-04
申请号：US17720847
申请日：2022-04-14
Applicant: Seagate Technology LLC
Inventor： Edwin Rejda , Andrew Habermas , Jeff O'Konski , Andrew Sherve , Michael Thomas Johnson , Dongming Liu
CPC classification number: B24B37/048 , G11B5/3169
Abstract: The present disclosure includes methods of lapping that include energizing one or more elements that are located proximal to a first magnetoresistive element in a transducer region and generate heat and cause the first magnetoresistive element to selectively expand in the lapping direction relative to one or more other magnetoresistive elements. The present disclosure also includes methods of lapping that use one or more thermal sensors located proximal to the first magnetoresistive element to help control lapping in the lapping direction. The present disclosure includes related lapping systems and sliders.
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4.发明公开公开(公告)号：US20230311268A1
公开(公告)日：2023-10-05
申请号：US18199526
申请日：2023-05-19
Applicant: Seagate Technology LLC
Inventor： Edwin Rejda , Andrew Habermas , Jeff O'Konski , Andrew Sherve , Michael Thomas Johnson , Dongming Liu
CPC classification number: B24B37/048 , G11B5/3169
Abstract: The present disclosure includes methods of lapping that include energizing one or more elements that are located proximal to a first magnetoresistive element in a transducer region and generate heat and cause the first magnetoresistive element to selectively expand in the lapping direction relative to one or more other magnetoresistive elements. The present disclosure also includes methods of lapping that use one or more thermal sensors located proximal to the first magnetoresistive element to help control lapping in the lapping direction. The present disclosure includes related lapping systems and sliders.
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公开(公告)号：US11331765B1
公开(公告)日：2022-05-17
申请号：US16383083
申请日：2019-04-12
Applicant: Seagate Technology LLC
Inventor： Andrew Sherve , Neil Zuckerman , Vasudevan Ramaswamy , Andrew Habermas
Abstract: The present disclosure includes methods and systems that include multiple lapping stages having at least one lapping stage that laps while a heat source is applied to cause expansion during lapping and at least one subsequent lapping stage that laps while the heat source is reduced (e.g., turned off).
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公开(公告)号：US11037586B1
公开(公告)日：2021-06-15
申请号：US16380056
申请日：2019-04-10
Applicant: Seagate Technology LLC
Inventor： Andrew Sherve , Jeff O'Konski , Yuhong Xiong , Andrew Habermas
Abstract: The present disclosure includes methods and systems for lapping a row bar of sliders. According to the present disclosure, an electrical interconnect configuration is provided that permits the net current provided to a row bar to heat electrical heating devices during lapping to be managed so as help prevent exceeding breakdown currents of related electrical channels.
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