公开(公告)号：US20220234166A1

公开(公告)日：2022-07-28

申请号：US17720847

申请日：2022-04-14

Applicant: Seagate Technology LLC

Inventor： Edwin Rejda ,  Andrew Habermas ,  Jeff O'Konski ,  Andrew Sherve ,  Michael Thomas Johnson ,  Dongming Liu

IPC: B24B37/04 ,  G11B5/31

Abstract: The present disclosure includes methods of lapping that include energizing one or more elements that are located proximal to a first magnetoresistive element in a transducer region and generate heat and cause the first magnetoresistive element to selectively expand in the lapping direction relative to one or more other magnetoresistive elements. The present disclosure also includes methods of lapping that use one or more thermal sensors located proximal to the first magnetoresistive element to help control lapping in the lapping direction. The present disclosure includes related lapping systems and sliders.

公开(公告)号：US11749300B2

公开(公告)日：2023-09-05

申请号：US16661564

申请日：2019-10-23

Applicant: Seagate Technology LLC

Inventor： Zubair Ahmed Khan ,  Dat Quach ,  Andrew Habermas ,  Joel William Hoehn

IPC: G11B5/31 ,  C09J175/04 ,  C09J133/10 ,  H01L21/683 ,  H01L21/304 ,  C09J7/38 ,  B24B37/04 ,  C09J175/08

CPC classification number: G11B5/3169 ,  B24B37/048 ,  C09J7/38 ,  C09J133/10 ,  C09J175/04 ,  H01L21/304 ,  H01L21/6836 ,  C08G2170/40 ,  C09J175/08 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2475/00 ,  H01L2221/68327

Abstract: Described are methods for processing microelectronic device substrates by a lapping step, e.g., a final lapping step, wherein the step includes the use of an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of the carrier during the lapping step, and wherein the pressure-sensitive adhesive can be a non-polysilicone based adhesive having mechanical properties that include a tan delta that is below about 0.2.

公开(公告)号：US20200061644A1

公开(公告)日：2020-02-27

申请号：US16542483

申请日：2019-08-16

Applicant: Seagate Technology LLC

Inventor： Nicholas Blum ,  Andrew Habermas ,  Ricky Anderson ,  Mihaela Ruxandra Baurceanu

IPC: B05B7/14 ,  B24B37/14 ,  B05B7/24

Abstract: The present disclosure involves apparatuses and methods for coating a lapping plate with an aqueous composition. The apparatus can be configured and the aqueous composition can be formulated so that the aqueous composition can flow to a spray nozzle device solely due to gravity in a batchwise manner.

公开(公告)号：US11691242B2

公开(公告)日：2023-07-04

申请号：US17720847

申请日：2022-04-14

Applicant: Seagate Technology LLC

Inventor： Edwin Rejda ,  Andrew Habermas ,  Jeff O'Konski ,  Andrew Sherve ,  Michael Thomas Johnson ,  Dongming Liu

IPC: G11B5/31 ,  B24B37/04

CPC classification number: B24B37/048 ,  G11B5/3169

Abstract: The present disclosure includes methods of lapping that include energizing one or more elements that are located proximal to a first magnetoresistive element in a transducer region and generate heat and cause the first magnetoresistive element to selectively expand in the lapping direction relative to one or more other magnetoresistive elements. The present disclosure also includes methods of lapping that use one or more thermal sensors located proximal to the first magnetoresistive element to help control lapping in the lapping direction. The present disclosure includes related lapping systems and sliders.

公开(公告)号：US11305397B2

公开(公告)日：2022-04-19

申请号：US16430540

申请日：2019-06-04

Applicant: Seagate Technology LLC

Inventor： Andrew Habermas ,  Dat Quach ,  Jeff O'Konski ,  Yuhong Xiong ,  Ricky Anderson ,  Joshua Zierhut

IPC: B24B37/015 ,  B24B37/04 ,  G11B5/31 ,  G11B5/60 ,  B24B37/10

Abstract: The present disclosure includes a lapping system that includes a temperature control system system to heat or cool the lapping plate while lapping. The temperature control system can include a closed circuit fluid system and/or one or more electrical resistive heating elements. In some embodiments that cooling system can control the temperature of the lapping plate during lapping to within +/−5° C., or even +/−0.5° C.

公开(公告)号：US11123758B2

公开(公告)日：2021-09-21

申请号：US16542483

申请日：2019-08-16

Applicant: Seagate Technology LLC

Inventor： Nicholas Blum ,  Andrew Habermas ,  Ricky Anderson ,  Mihaela Ruxandra Baurceanu

IPC: B05D1/12 ,  B05B7/14 ,  B05B7/24 ,  B24B37/14 ,  B05B15/60

Abstract: The present disclosure involves apparatuses and methods for coating a lapping plate with an aqueous composition. The apparatus can be configured and the aqueous composition can be formulated so that the aqueous composition can flow to a spray nozzle device solely due to gravity in a batchwise manner.

公开(公告)号：US20230311268A1

公开(公告)日：2023-10-05

申请号：US18199526

申请日：2023-05-19

Applicant: Seagate Technology LLC

Inventor： Edwin Rejda ,  Andrew Habermas ,  Jeff O'Konski ,  Andrew Sherve ,  Michael Thomas Johnson ,  Dongming Liu

IPC: B24B37/04 ,  G11B5/31

CPC classification number: B24B37/048 ,  G11B5/3169

Abstract: The present disclosure includes methods of lapping that include energizing one or more elements that are located proximal to a first magnetoresistive element in a transducer region and generate heat and cause the first magnetoresistive element to selectively expand in the lapping direction relative to one or more other magnetoresistive elements. The present disclosure also includes methods of lapping that use one or more thermal sensors located proximal to the first magnetoresistive element to help control lapping in the lapping direction. The present disclosure includes related lapping systems and sliders.

公开(公告)号：US11331765B1

公开(公告)日：2022-05-17

申请号：US16383083

申请日：2019-04-12

Applicant: Seagate Technology LLC

Inventor： Andrew Sherve ,  Neil Zuckerman ,  Vasudevan Ramaswamy ,  Andrew Habermas

IPC: B24B49/00 ,  B24B37/04 ,  G11B5/10

Abstract: The present disclosure includes methods and systems that include multiple lapping stages having at least one lapping stage that laps while a heat source is applied to cause expansion during lapping and at least one subsequent lapping stage that laps while the heat source is reduced (e.g., turned off).

公开(公告)号：US20210379613A1

公开(公告)日：2021-12-09

申请号：US17411946

申请日：2021-08-25

Applicant: Seagate Technology LLC

Inventor： Nicholas Blum ,  Andrew Habermas ,  Ricky Anderson ,  Mihaela Ruxandra Baurceanu

IPC: B05B7/14 ,  B05B7/24 ,  B24B37/14

Abstract: The present disclosure involves apparatuses and methods for coating a lapping plate with an aqueous composition. The apparatus can be configured and the aqueous composition can be formulated so that the aqueous composition can flow to a spray nozzle device solely due to gravity in a batchwise manner.

公开(公告)号：US11037586B1

公开(公告)日：2021-06-15

申请号：US16380056

申请日：2019-04-10

Applicant: Seagate Technology LLC

Inventor： Andrew Sherve ,  Jeff O'Konski ,  Yuhong Xiong ,  Andrew Habermas

IPC: G11B5/31 ,  B24B37/04

Abstract: The present disclosure includes methods and systems for lapping a row bar of sliders. According to the present disclosure, an electrical interconnect configuration is provided that permits the net current provided to a row bar to heat electrical heating devices during lapping to be managed so as help prevent exceeding breakdown currents of related electrical channels.