公开(公告)号：US20150007430A1

公开(公告)日：2015-01-08

申请号：US13933945

申请日：2013-07-02

Applicant: Seagate Technology LLC

Inventor： Kim Sek Tan ,  Choong Kit Mah ,  Soo Chun Loh ,  Choon Yen Lim ,  Chin Chong Yew ,  Leping Li ,  Yuik Zhi Lim

IPC: B24B37/30

CPC classification number: B24B37/30 ,  Y10T29/49998

Abstract: Implementations disclosed herein allow a printed circuit board (PCB) to be removeably secured to a lapping carrier. The lapping carrier may include a clamping mechanism and one or more alignment pins that thread through corresponding holes in the PCB. In other implementations, the lapping carrier includes insulation that prevents current leakage or short-circuiting of electrical paths on the PCB during contact with the clamping mechanism.

Abstract translation: 本文公开的实施方案允许印刷电路板（PCB）可移除地固定到研磨载体上。 研磨载体可以包括夹紧机构和穿过PCB中相应孔的一个或多个对准销。 在其他实施方式中，研磨载体包括绝缘，其防止在与夹紧机构接触期间PCB上的电路径的电流泄漏或短路。

公开(公告)号：US09352442B2

公开(公告)日：2016-05-31

申请号：US13933945

申请日：2013-07-02

Applicant: Seagate Technology LLC

Inventor： Kim Sek Tan ,  Choong Kit Mah ,  Soo Chun Loh ,  Choon Yen Lim ,  Chin Chong Yew ,  Leping Li ,  Yuik Zhi Lim

IPC: B23P19/00 ,  B24B37/30

CPC classification number: B24B37/30 ,  Y10T29/49998

Abstract: Implementations disclosed herein allow a printed circuit board (PCB) to be removeably secured to a lapping carrier. The lapping carrier may include a clamping mechanism and one or more alignment pins that thread through corresponding holes in the PCB. In other implementations, the lapping carrier includes insulation that prevents current leakage or short-circuiting of electrical paths on the PCB during contact with the clamping mechanism.

Abstract translation: 本文公开的实施方案允许印刷电路板（PCB）可移除地固定到研磨载体上。 研磨载体可以包括夹紧机构和穿过PCB中相应孔的一个或多个对准销。 在其他实施方式中，研磨载体包括绝缘，其防止在与夹紧机构接触期间PCB上的电路径的电流泄漏或短路。