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公开(公告)号：US20150082650A1
公开(公告)日：2015-03-26
申请号：US14036893
申请日：2013-09-25
Applicant: Seagate Technology LLC
Inventor： Leping Li , Sarah R. Marotz , Kara L. Maytag
CPC classification number: G01B3/18 , G01B11/06 , G01B11/24 , G01B2210/44
Abstract: A device and system for precise measurement of a thickness and determination of a profile of a slider row bar. The device includes a bar mount fixture having a structure for supporting the row bar by an edge, a first probe and a second probe on either side of the row bar, each probe being a non-contact sensor with a measurement precision of 0.5 micrometer, with each of the probes laterally moveable in relation to the bar mount fixture. Also included are methods of using a device for precisely measuring of a thickness and determining of a profile of a slider row bar.
Abstract translation: 用于精确测量滑块排条的厚度和确定轮廓的装置和系统。 该装置包括具有用于通过边缘支撑行杆的结构的杆安装固定件，在排条的任一侧上的第一探针和第二探针，每个探针是具有0.5微米测量精度的非接触式传感器， 每个探头可相对于杆安装夹具横向移动。 还包括使用用于精确测量厚度的装置和确定滑块排条的轮廓的方法。
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公开(公告)号：US20150007430A1
公开(公告)日：2015-01-08
申请号：US13933945
申请日：2013-07-02
Applicant: Seagate Technology LLC
Inventor： Kim Sek Tan , Choong Kit Mah , Soo Chun Loh , Choon Yen Lim , Chin Chong Yew , Leping Li , Yuik Zhi Lim
IPC: B24B37/30
CPC classification number: B24B37/30 , Y10T29/49998
Abstract: Implementations disclosed herein allow a printed circuit board (PCB) to be removeably secured to a lapping carrier. The lapping carrier may include a clamping mechanism and one or more alignment pins that thread through corresponding holes in the PCB. In other implementations, the lapping carrier includes insulation that prevents current leakage or short-circuiting of electrical paths on the PCB during contact with the clamping mechanism.
Abstract translation: 本文公开的实施方案允许印刷电路板（PCB）可移除地固定到研磨载体上。 研磨载体可以包括夹紧机构和穿过PCB中相应孔的一个或多个对准销。 在其他实施方式中，研磨载体包括绝缘，其防止在与夹紧机构接触期间PCB上的电路径的电流泄漏或短路。
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公开(公告)号：US09115980B2
公开(公告)日：2015-08-25
申请号：US14036893
申请日：2013-09-25
Applicant: Seagate Technology LLC
Inventor： Leping Li , Sarah R. Marotz , Kara L. Maytag
CPC classification number: G01B3/18 , G01B11/06 , G01B11/24 , G01B2210/44
Abstract: A device and system for precise measurement of a thickness and determination of a profile of a slider row bar. The device includes a bar mount fixture having a structure for supporting the row bar by an edge, a first probe and a second probe on either side of the row bar, each probe being a non-contact sensor with a measurement precision of 0.5 micrometer, with each of the probes laterally moveable in relation to the bar mount fixture. Also included are methods of using a device for precisely measuring of a thickness and determining of a profile of a slider row bar.
Abstract translation: 用于精确测量滑块排条的厚度和确定轮廓的装置和系统。 该装置包括具有用于通过边缘支撑行杆的结构的杆安装固定件，在排条的任一侧上的第一探针和第二探针，每个探针是具有0.5微米测量精度的非接触式传感器， 每个探头可相对于杆安装夹具横向移动。 还包括使用用于精确测量厚度的装置和确定滑块排条的轮廓的方法。
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公开(公告)号：US09478237B2
公开(公告)日：2016-10-25
申请号：US14030412
申请日：2013-09-18
Applicant: Seagate Technology LLC
Inventor： Leping Li , Jeffrey Robert O'Konski , Saravuth Keo , Pramit P. Parikh
CPC classification number: G11B5/3169
Abstract: A data storage device may be tested during or after manufacture by a testing device that may have at least a work piece with at least one contact pad concurrently contacting bottom and sidewall surfaces of a probe tip with a centering feature of the at least one contact pad.
Abstract translation: 数据存储装置可以在制造期间或之后由测试装置进行测试，该测试装置可以具有至少一个工件，其中至少一个接触垫同时与探针尖端的底部和侧壁表面接触，并具有至少一个接触垫的定中心特征 。
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公开(公告)号：US20150077148A1
公开(公告)日：2015-03-19
申请号：US14030412
申请日：2013-09-18
Applicant: Seagate Technology LLC
Inventor： Leping Li , Jeffrey Robert O'Konski , Saravuth Keo , Pramit P. Parikh
IPC: G11B5/455
CPC classification number: G11B5/3169
Abstract: A data storage device may be tested during or after manufacture by a testing device that may have at least a work piece with at least one contact pad concurrently contacting bottom and sidewall surfaces of a probe tip with a centering feature of the at least one contact pad.
Abstract translation: 数据存储装置可以在制造期间或之后由测试装置进行测试，该测试装置可以具有至少一个工件，其中至少一个接触垫同时与探针尖端的底部和侧壁表面接触，并具有至少一个接触垫的定中心特征 。
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Patent Agency Ranking
公开(公告)号：US09352442B2
公开(公告)日：2016-05-31
申请号：US13933945
申请日：2013-07-02
Applicant: Seagate Technology LLC
Inventor： Kim Sek Tan , Choong Kit Mah , Soo Chun Loh , Choon Yen Lim , Chin Chong Yew , Leping Li , Yuik Zhi Lim
CPC classification number: B24B37/30 , Y10T29/49998
Abstract: Implementations disclosed herein allow a printed circuit board (PCB) to be removeably secured to a lapping carrier. The lapping carrier may include a clamping mechanism and one or more alignment pins that thread through corresponding holes in the PCB. In other implementations, the lapping carrier includes insulation that prevents current leakage or short-circuiting of electrical paths on the PCB during contact with the clamping mechanism.
Abstract translation: 本文公开的实施方案允许印刷电路板（PCB）可移除地固定到研磨载体上。 研磨载体可以包括夹紧机构和穿过PCB中相应孔的一个或多个对准销。 在其他实施方式中，研磨载体包括绝缘，其防止在与夹紧机构接触期间PCB上的电路径的电流泄漏或短路。
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公开(公告)号：US09308622B2
公开(公告)日：2016-04-12
申请号：US14057368
申请日：2013-10-18
Applicant: Seagate Technology LLC
Inventor： Leping Li , Andrew S. Menz , John F. Schmidt , Stephen J. Mackin
IPC: B24B49/10 , B24B37/013 , B24B37/04 , B24B49/12
CPC classification number: B24B49/105 , B24B37/013 , B24B37/048 , B24B49/12
Abstract: The application discloses embodiments of a lapping head including a sensor device in the base structure of the rotating lapping head. For operation, rotation is imparted to the lapping head through a drive motor coupled to the lapping head through a rotating shaft. As disclosed, the sensor device is electrically connected to one or more electronic components or circuitry through the rotating shaft and a rotating electrical connector coupled to the rotating shaft. In embodiments disclosed, the sensor device is an eddy current sensor configured to measure a gap dimension between a sensor element on the lapping head and a conductive platen to provide an in-situs measurement of workpiece thickness.
Abstract translation: 本申请公开了一种研磨头的实施例，其包括在旋转研磨头的基部结构中的传感器装置。 为了操作，通过经由旋转轴联接到研磨头的驱动马达向研磨头施加旋转。 如所公开的，传感器装置通过旋转轴和连接到旋转轴的旋转电连接器电连接到一个或多个电子部件或电路。 在所公开的实施例中，传感器装置是涡流传感器，其构造成测量研磨头上的传感器元件与导电台板之间的间隙尺寸，以提供工件厚度的位置测量。
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8.发明申请公开(公告)号：US20150260757A1
公开(公告)日：2015-09-17
申请号：US14216186
申请日：2014-03-17
Applicant: Seagate Technology LLC
Inventor： Leping Li , Kara L. Maytag , Saravuth Keo
CPC classification number: G11B5/3166 , G11B5/3169
Abstract: A lapping system including a substrate having an air bearing surface and at least one slider, wherein each slider comprises at least one electronic lapping guide pad, and a probe card comprising at least one extending probe comprising a body member and a distal end, the probe card being movable in a direction of compression between a first position in which the distal end of a first extending probe is spaced from a top surface of one of a first electronic lapping guide pad and a second position in which the distal end of the first extending probe contacts the top surface the first electronic lapping guide pad, wherein the first extending probe is pre-loaded with a predetermined spring force in the direction of compression.
Abstract translation: 一种研磨系统，包括具有空气轴承表面的基底和至少一个滑块，其中每个滑块包括至少一个电子研磨导向垫，以及包括至少一个包括主体构件和远端的延伸探针的探针卡，探针 卡可以在第一位置和第二位置之间沿压缩方向移动，在第一位置，第一延伸探针的远端与第一电子研磨引导垫中的一个的顶表面间隔开，第二位置中第一延伸探针的远端 探针与顶表面接触第一电子研磨引导垫，其中第一延伸探针在压缩方向上预加载有预定的弹簧力。
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公开(公告)号：US20150111468A1
公开(公告)日：2015-04-23
申请号：US14057368
申请日：2013-10-18
Applicant: Seagate Technology LLC
Inventor： Leping Li , Andrew S. Menz , John F. Schmidt , Stephen J. Mackin
IPC: B24B49/10 , B24B37/04 , B24B37/013
CPC classification number: B24B49/105 , B24B37/013 , B24B37/048 , B24B49/12
Abstract: The application discloses embodiments of a lapping head including a sensor device in the base structure of the rotating lapping head. For operation, rotation is imparted to the lapping head through a drive motor coupled to the lapping head through a rotating shaft. As disclosed, the sensor device is electrically connected to one or more electronic components or circuitry through the rotating shaft and a rotating electrical connector coupled to the rotating shaft. In embodiments disclosed, the sensor device is an eddy current sensor configured to measure a gap dimension between a sensor element on the lapping head and a conductive platen to provide an in-situs measurement of workpiece thickness.
Abstract translation: 本申请公开了一种研磨头的实施例，其包括在旋转研磨头的基部结构中的传感器装置。 为了操作，通过经由旋转轴联接到研磨头的驱动马达向研磨头施加旋转。 如所公开的，传感器装置通过旋转轴和连接到旋转轴的旋转电连接器电连接到一个或多个电子部件或电路。 在所公开的实施例中，传感器装置是涡流传感器，其构造成测量研磨头上的传感器元件与导电台板之间的间隙尺寸，以提供工件厚度的位置测量。
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公开(公告)号：US08767351B1
公开(公告)日：2014-07-01
申请号：US13755175
申请日：2013-01-31
Applicant: Seagate Technology LLC
Inventor： Leping Li , Saravuth Keo , Kara L. Maytag , Pramit P. Parikh , Jeff R. O'Konski , Mark A. Herendeen , Joel W. Hoehn , Roger L. Hipwell , Joe J. Schobel , John L. Ibele , Ralph Marquart , Edward Knutson
IPC: G11B5/48
CPC classification number: G11B5/102 , G11B5/3169 , G11B5/3173 , G11B5/4826 , G11B2005/0021 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05644 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/48463 , H01L2224/48644 , H01L2224/85012 , H01L2224/85099 , H01L2224/85205 , H01L2924/12042 , H01L2924/20751 , H01L2924/20303 , H01L2924/20304 , H01L2924/20305 , H01L2924/20306 , H01L2924/20307 , H01L2924/20308 , H01L2924/20309 , H01L2924/20752 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
Abstract: The presently disclosed technology describes systems and methods for attaining a ball bond using less than 1 thousandth of an inch diameter gold wire using ultrasonic bonding energy and without heating an underlying bonding pad. The ball bond allows the use of particularly small bonding pads that are particularly close to adjacent microelectronic structures that limit the use of other bonding techniques that have shallow take-off angles.
Abstract translation: 目前公开的技术描述了使用超过千分之一英寸直径的金线使用超声波接合能量并且不加热下面的焊盘来获得球接合的系统和方法。 球接合允许使用特别接近相邻微电子结构的特别小的接合焊盘，其限制了具有浅起飞角的其它接合技术的使用。
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