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公开(公告)号：US20200038982A1
公开(公告)日：2020-02-06
申请号：US16051682
申请日：2018-08-01
Applicant: Seagate Technology LLC
Inventor： Jonathan Paul Robelia , Paul Davidson , Amy Jo Bergerud
IPC: B23K3/06
Abstract: Implementations described and claimed herein address the foregoing problems by providing a soldering method including mixing a plurality of spheres in a bond-head hopper wherein a first number of the plurality of the spheres have a diameter that is at least fifty (50) percent larger than the rest of the plurality of spheres.
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