公开(公告)号：US10763205B2

公开(公告)日：2020-09-01

申请号：US15649337

申请日：2017-07-13

Applicant: Seagate Technology LLC

Inventor： Pritesh Pawaskar ,  Yehuda Smooha ,  Shrikrishna Nana Mehetre

IPC: H01L23/50 ,  H01L23/498 ,  H01L27/02 ,  H01L23/00

Abstract: An input/output (I/O) circuit includes at least one I/O cell having a first size, and a high current circuit coupled to the at least one I/O cell. The high current circuit has a second size that is smaller than the first size. A connection bus is coupled to the high current circuit. The connection bus has the second size and is positioned in substantially a same location within the I/O circuit as the high current circuit. A bump or a bond pad is coupled to the connection bus.