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公开(公告)号：US10964342B1
公开(公告)日：2021-03-30
申请号：US16890385
申请日：2020-06-02
Applicant: Seagate Technology LLC
IPC: G11B5/48
Abstract: A method of controlling a shape and size of at least one solder joint of a magnetic recording head that includes a trailing surface and a plurality of bond pads, wherein each bond pad comprises a base layer comprising a top surface and a top edge, the method including the steps of forming at least one solder dam by covering a portion of the top surface of the base layer of at least one of the bond pads with a coating layer that comprises a nonwettable, electrically conductive material positioned adjacent to the top edge of at least one of the bond pads, thereby defining a coated portion and an uncoated portion of the base layer, and applying solder material to the uncoated portion of the base layer adjacent to the solder dam so that the coating layer constrains movement of the solder material beyond the uncoated portion.
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公开(公告)号：US10706880B1
公开(公告)日：2020-07-07
申请号：US16372898
申请日：2019-04-02
Applicant: Seagate Technology LLC
IPC: G11B5/48
Abstract: A magnetic recording head is provided including a body with a trailing surface, a plurality of bond pads in a row, each of which is spaced by a gap from an adjacent bond pad along a width of the trailing surface. Each bond pad includes a base layer having a top surface, a coating layer covering at least a portion of the top surface of the base layer, two side edges spaced from each other across a width of the bond pad, wherein a width of the gap between adjacent bond pads is defined by one side edge of each of two adjacent bond pads, a top edge extending between the two side edges, and at least one solder dam comprising a nonwettable, electrically conductive material positioned adjacent to the top edge of at least one of the bond pads.
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