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公开(公告)号：US10646943B2
公开(公告)日：2020-05-12
申请号：US15361714
申请日：2016-11-28
Applicant: Seagate Technology LLC
Inventor： Aaron Michael Collins , Scott Daemon Matzke , Paul Davidson , Christopher R. Libby
Abstract: A method for interconnecting multiple components of an electrical assembly with a solder joint, including the steps of positioning a first component adjacent to a second component to provide a connection area, dispensing a solid solder sphere to a capillary tube, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, applying a first laser through the capillary tube while measuring light from the first laser that reflects off the connection area as the solder sphere moves through the capillary tube, and applying a second laser to at least partially melt the solder sphere when the measured light decreases to a predetermined level and as the solder sphere falls from the exit orifice toward the connection area between the first and second components.
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公开(公告)号：US11651785B1
公开(公告)日：2023-05-16
申请号：US17728661
申请日：2022-04-25
Applicant: Seagate Technology LLC
Inventor： Joseph M. Stephan , Robert Aaron Newman , Lars H. Ahlen , Aaron Michael Collins
CPC classification number: G11B5/6082 , G11B5/3163 , G11B5/1278
Abstract: Methods are described for forming a mounting surface on a slider body. In one method, an adhesion layer can be deposited on a top surface of a slider body. A first photolithography cycle deposits a first metal layer having a first thickness of at least 8 μm. A second photolithography cycle deposits a second metal layer having a second thickness of at least 8 μm over the first metal layer. The first and second layer form a mounting support on the top surface. In another method, the top surface is etched to form a mounting support.
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公开(公告)号：US10706880B1
公开(公告)日：2020-07-07
申请号：US16372898
申请日：2019-04-02
Applicant: Seagate Technology LLC
IPC: G11B5/48
Abstract: A magnetic recording head is provided including a body with a trailing surface, a plurality of bond pads in a row, each of which is spaced by a gap from an adjacent bond pad along a width of the trailing surface. Each bond pad includes a base layer having a top surface, a coating layer covering at least a portion of the top surface of the base layer, two side edges spaced from each other across a width of the bond pad, wherein a width of the gap between adjacent bond pads is defined by one side edge of each of two adjacent bond pads, a top edge extending between the two side edges, and at least one solder dam comprising a nonwettable, electrically conductive material positioned adjacent to the top edge of at least one of the bond pads.
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公开(公告)号：US20190122694A1
公开(公告)日：2019-04-25
申请号：US15788886
申请日：2017-10-20
Applicant: Seagate Technology LLC
Inventor： Paul Davidson , Scott Damon Matzke , Aaron Michael Collins
Abstract: A magnetic recording head including a trailing surface and a plurality of bond pads in a row, each of which is spaced by a gap from an adjacent bond pad along a width of the trailing surface. Each bond pad includes two side edges spaced from each other across a width of the bond pad, wherein a width of the gap between adjacent bond pads is defined by one side edge of each of two adjacent bond pads, and a top edge extending between the two side edges. The head further includes at least one solder dam including a nonwettable, electrically conductive solder material positioned adjacent to the top edge of at least one of the bond pads.
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Patent Agency Ranking
公开(公告)号：US20240157457A1
公开(公告)日：2024-05-16
申请号：US18505287
申请日：2023-11-09
Applicant: Seagate Technology LLC
Inventor： Daniel Glen Hardy , Aaron Michael Collins , Joseph Langford Nelson
CPC classification number: B23K1/0016 , B23K1/0056
Abstract: A method of interconnecting multiple components of an electrical assembly with a solder joint that includes the steps of positioning a suspension adjacent to a slider to provide a connection area between the suspension and the slider, wherein the suspension comprises a pre-deposited quantity of solder material with a height that provides for a predefined gap between a lower surface of the slider and an upper surface of the solder material, and applying energy to the solder material to melt the solder material and allow it to move toward and contact the lower surface of the slider.
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公开(公告)号：US20180147646A1
公开(公告)日：2018-05-31
申请号：US15361714
申请日：2016-11-28
Applicant: Seagate Technology LLC
Inventor： Aaron Michael Collins , Scott Daemon Matzke , Paul Davidson , Christopher R. Libby
CPC classification number: B23K1/0056 , B23K1/0016 , H01R43/0221
Abstract: A method for interconnecting multiple components of an electrical assembly with a solder joint, including the steps of positioning a first component adjacent to a second component to provide a connection area, dispensing a solid solder sphere to a capillary tube, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, applying a first laser through the capillary tube while measuring light from the first laser that reflects off the connection area as the solder sphere moves through the capillary tube, and applying a second laser to at least partially melt the solder sphere when the measured light decreases to a predetermined level and as the solder sphere falls from the exit orifice toward the connection area between the first and second components.
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公开(公告)号：US11355144B1
公开(公告)日：2022-06-07
申请号：US17317277
申请日：2021-05-11
Applicant: Seagate Technology LLC
Inventor： Joseph M. Stephan , Robert Aaron Newman , Lars H. Ahlen , Aaron Michael Collins
Abstract: A slider includes a slider body with an air-bearing surface and a top surface opposing the air-bearing surface. A plurality of slider bond pads are disposed on or parallel to the top surface and proximate to or at a trailing edge of the slider. The plurality of slider bond pads have an exposed surface facing away from the top surface of the slider body. One or more mounting supports extend from the top surface to a distance of at least 12 μm above the exposed surface of the plurality of slider bond pads.
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公开(公告)号：US10964342B1
公开(公告)日：2021-03-30
申请号：US16890385
申请日：2020-06-02
Applicant: Seagate Technology LLC
IPC: G11B5/48
Abstract: A method of controlling a shape and size of at least one solder joint of a magnetic recording head that includes a trailing surface and a plurality of bond pads, wherein each bond pad comprises a base layer comprising a top surface and a top edge, the method including the steps of forming at least one solder dam by covering a portion of the top surface of the base layer of at least one of the bond pads with a coating layer that comprises a nonwettable, electrically conductive material positioned adjacent to the top edge of at least one of the bond pads, thereby defining a coated portion and an uncoated portion of the base layer, and applying solder material to the uncoated portion of the base layer adjacent to the solder dam so that the coating layer constrains movement of the solder material beyond the uncoated portion.
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公开(公告)号：US08947830B1
公开(公告)日：2015-02-03
申请号：US14300442
申请日：2014-06-10
Applicant: Seagate Technology LLC
Inventor： Aaron Michael Collins , Scott Matzke , Christopher Unger , Paul Davidson , Daniel Richard Buettner
IPC: G11B5/48
CPC classification number: G11B5/4853
Abstract: A method for forming an electrical interconnection between a slider pad and a suspension pad that is adjacent to and positioned at an angle relative to the slider pad, which includes the steps of forming a solder bump on a first surface of the slider pad, reshaping the solder bump into a protrusion having an ellipsoidal shape that extends from the slider pad and contacts the suspension pad, and applying a laser to the ellipsoidal protrusion to reflow the solder bump while simultaneously applying a downward pressure to the solder bump in order to form a solder fillet between the slider pad and the suspension pad.
Abstract translation: 一种用于在滑块和悬挂垫之间形成电相互连接的方法，该方法与滑块相邻且相对于滑块形成一定角度，该方法包括以下步骤：在滑块的第一表面上形成焊料凸点，重新形成 焊料凸块进入具有从滑块垫延伸并接触悬挂垫的椭圆形状的突起，并将激光施加到椭圆形突起以回流焊料凸块，同时向焊料凸块施加向下的压力以形成焊料 滑块和悬挂垫之间的圆角。
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